Metal plate levelling process
A metal plate and process technology, applied in the field of metal plate leveling technology, can solve the problems of long time, low surface flatness of metal plate, and troublesome leveling, so as to improve the flatness, shorten the leveling time, and facilitate leveling Effect
Inactive Publication Date: 2010-06-16
JIANGSU YINHE ELECTRONICS
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Problems solved by technology
This method is not only troublesome and takes a long time to level, but also the flatness of the metal plate surface after leveling is not high.
Method used
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Experimental program
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Embodiment Construction
[0006] The metal plate leveling process of the present invention includes the following steps: locally heating the uneven part of the metal plate, and then splashing cold water on the part.
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Abstract
The invention discloses a metal plate levelling process which has the advantages of having simple operation and improving the flatness of a metal plate. The metal plate levelling process comprise the following steps: locally heating an uneven part of the metal plate; and then, splashing cold water to the uneven part. According to a principle of expansion on heating and contraction on cooling, through the method of heating first and then cooling, the metal plate can be conveniently leveled, the levelling time is greatly shortened, and the work efficiency is improved; and meanwhile, the flatness of the metal plate after the levelling is also improved.
Description
Technical field [0001] The invention relates to a metal plate leveling process. Background technique [0002] As we all know, the uneven metal plates are usually flattened by direct hammering. In this way, not only the leveling is troublesome and takes a long time, but the flatness of the surface of the metal plate after leveling is not high. Summary of the invention [0003] A technical problem to be solved by the present invention is to provide a metal plate leveling process that is simple to operate and can improve the flatness of the metal plate. [0004] In order to solve the above technical problems, the present invention adopts a technical solution: a metal plate leveling process, the steps of which are: locally heating the uneven part of the metal plate, and then splashing the part with cold water. [0005] The beneficial effects of the present invention are: according to the principle of thermal expansion and contraction, the metal plate can be leveled very conveniently by ...
Claims
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IPC IPC(8): B21D1/00B21D1/06
Inventor 陈维荣虞向东
Owner JIANGSU YINHE ELECTRONICS
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