Area array adaptor

一种球栅阵列、栅格阵列的技术，应用在电路板组件领域，能够解决节头寿命减少、断裂等问题

Inactive Publication Date: 2010-07-07
HAMILTON SUNDSTRAND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This stress can lead to reduced joint life and can lead to potential fracture

Method used

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  • Area array adaptor
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  • Area array adaptor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] refer to figure 1 , illustrates an exemplary apparatus having a BGA component 120 , an area array adapter 122 , and a circuit board 124 through an exploded view. In this example, BGA component 120 includes an array of solder balls 104 on the bottom surface of component working portion 102 . Individual solder balls 104 in the array are capable of forming an electrical connection between component working portion 102 and other objects such as adapter 122 .

[0013] figure 1 A cross-sectional view of adapter 122 is shown in , providing a view of leads 106 inside area array adapter 122 . Each lead 106 is conductive and corresponds to the connection required for the BGA component 120 / circuit board 124 connection. Each lead 106 is held in a carrier material 108 . The carrier material 108 is electrically non-conductive and, depending on the material composition, can also provide a cushion for thermal expansion and contraction of the circuit board 124 , adapter 122 , and B...

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PUM

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Abstract

An adaptor for connecting ball grid array components to a circuit board with a leaded grid array joint, utilizing electric leads which can connect to a ball grid array on one end and a leaded grid array pad pattern on the opposite end.

Description

technical field [0001] This application relates to circuit board assemblies, and more particularly to adapters for connecting electrical components having ball grid array connectors to circuit boards having wire grid array connectors. Background technique [0002] When building a circuit board for a specific function, a common approach is to "print" the electrical connections onto the board, and then place the non-printable parts (such as microchips, capacitors, etc.) place using connectors to complete the circuit. There are a variety of standard linker types used in the art to make these connections. [0003] One type of joint is a ball grid array (BGA) joint in which components have solder balls at each connection that are attached to the board using the full heat method of soldering the component to the board. [0004] One disadvantage of using a BGA connector type is that the solder and electrical components have different rates of thermal expansion / contraction than th...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01R33/94H01R33/74H01R12/16H05K1/18
CPCH01R13/2478H05K7/1053H05K2201/10946H01R12/7082H01R12/716H05K3/3426H01R12/57H01R13/2435H01R13/41H01R23/6886H01R13/2485H05K2201/10734Y02P70/50
InventorC·V·德桑蒂斯D·E·伯彻尔
OwnerHAMILTON SUNDSTRAND CORP