Radiating block package structure with locking hole for normal installation of printed circuit board chip

Abstract

The invention relates to a radiating block package structure with a locking hole for the normal installation of a printed circuit board chip. The structure comprises a chip (3), a single-layer or multi-layer printed circuit board (9), metal wires (5), conductive or non-conductive heat-conducting bonding material I (2) and a plastic package body (8), wherein the single-layer or multi-layer printed circuit board (9) is supported below the chip, the metal wires (5) are used to interconnect the chip with the single-layer or multi-layer printed circuit board in a signaling way, and the conductive or non-conductive heat-conducting bonding material I (2) are arranged between the chip and the single-layer or multi-layer printed circuit board (9). The invention is characterized in that a radiating block (7) is arranged above the chip (3) and is provided with a locking hole (7.1), and non-conductive heat-conducting bonding material II (6) is inlaid between the radiating block (7) and the chip (3). Through adding the radiating block above the chip to dissipate high heat, the invention has the advantages that the heat dissipation capacity is high, the heat of the chip can be rapidly conducted to the outside of the package body, and the situation that the chip is aged rapidly and is even burned or damaged is avoided.

Description

(1) Technical field [0001] The invention relates to a packaging structure of a heat dissipation block with locking holes for front mounting of printed circuit board chips. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very small, a...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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