Totally-wrapped packaging structure of radiating block for chip of printed circuit board

Abstract

The invention relates to a totally-wrapped packaging structure of radiating block for chip of printed circuit board, which comprises a chip (3), a single-layer or multi-layer printed circuit board (9), a wire (5), a conductive or non-conductive heat-conducting bonding substance I (2) and a plastic packaging body (8), wherein the single-layer or multi-layer printed circuit board (9) is supported below the chip; the wire (5) is used for communicating signals between the chip and the single-layer or multi-layer printed circuit board; the conductive or non-conductive heat-conducting bonding substance I (2) is arranged between the chip and the single-layer or multi-layer printed circuit board (9). The invention is characterized in that a radiating block (7) is arranged above the chip (3); a conductive or non-conductive heat-conducting bonding substance II (6) is nested between the radiating block (7) and the chip (3); and the radiating block (7) is totally wrapped in the plastic packaging body (8). By additionally arranging the radiating block above the chip to radiate high heat, the invention can provide strong radiating capacity so that the heat of the chip can be quickly conducted to the outside of the packaging body.

Description

(1) Technical field [0001] The invention relates to a full-cover packaging structure of a printed circuit board chip being mounted on a heat dissipation block. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very small, and at the sa...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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