External connection heat radiator encapsulation structure of positive installation rectangular heat radiation block of base island exposed chip

Abstract

The invention relates to an external connection heat radiator encapsulation structure of a positive installation rectangular heat radiation block of a base island exposed chip, which comprises a chip (3), a metal base island (1), a metal inner pin (4), a metal wire (5), a first conductive or nonconductive heat-conductive adhesive material (2) and an insulated plastic encapsulation body (8), wherein the metal base island (1) is carried under the chip, the metal wire (5) is used for signal interconnection from the chip to the metal inner pin, the first conductive or nonconductive heat-conductive adhesive material (2) is arranged between the chip and the metal island, and the metal base island (1) is exposed out of the plastic encapsulation body (8). The invention is characterized in that a heat radiation block (7) is arranged above the chip (3), a second conductive or nonconductive heat-conductive adhesive material (6) is embedded and arranged between the heat radiation block (7) and the chip (3), a heat radiator (11) is arranged above the heat radiation block (7), a third conductive or nonconductive heat-conductive adhesive material (13) is embedded and arranged between the heat radiator (11) and the heat radiation block (7), and the heat radiation block (7) is in a rectangular structure. The encapsulation structure of the invention can provide strong heat radiation capability.

Description

(1) Technical field [0001] The invention relates to a package structure of a base island exposing a chip and a rectangular heat dissipation block externally connected to a heat sink. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are ve...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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