Paddle-exposed and chip-upright packaging structure for heat dissipation block with locking holes

Abstract

The invention relates to a paddle-exposed and chip-upright packaging structure for heat dissipation block with locking holes, which comprises a chip (3), a metal paddle (1) carried below the chip, a metal inner pin (4), a metal wire (5) for interconnecting signals from the chip to the metal inner pin, a conductive or nonconductive heat-conducting bonding substance I (2) between the chip and the metal paddle and a plastic packaging body (8), wherein the metal paddle (1) exposes out of the plastic packaging body (8). The packaging structure is characterized in that a heat dissipation block (7) is arranged above the chip (3) and is provided with locking holes (7.1); and a conductive or nonconductive heat-conducting bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3). By arranging the heat dissipation block above the chip to play the function of dissipating high heat, the packaging structure has strong ability of heat dissipation so that the heat of the chip can be quickly conducted to the outside of the plastic packaging body, and thereby avoiding quick ageing or even burning or burning-out of the chip.

Description

technical field [0001] The invention relates to a packaging structure of a cooling block with a base island exposing a chip and mounting a locking hole. It belongs to the technical field of semiconductor packaging. Background technique [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet (such as figure 1 and figure 2 As shown), so the effective area and volume of the metal-based island are very small, and at the same time, the m...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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