Down and up arranged resin circuit board and chip packaging structure with inverted rectangular radiation block

Abstract

The invention relates to a down and up arranged resin circuit board and chip packaging structure with an inverted rectangular radiation block, which comprises a chip (3), a single-layer or multi-layer resin circuit board (9) supported below the chip, metal bumps (10) for interworking signals from the chip to the single-layer or multi-layer resin circuit board, a conductive or non-conductive heat-conducting binding material I (2) between the chip and the single-layer or multi-layer resin circuit board and a plastic packaging body (8). The packaging structure is characterized in that: the radiation block (7) is arranged above the chip (3); a conductive or non-conductive heat-conducting binding material II (6) is embedded between the radiation block (7) and the chip (3); and the radiation block (7) has a rectangular structure. The radiation block is arranged above the chip and used for radiating high heat, so the packaging structure has high radiating capability, and ensures that the heat of the chip can be quickly conducted to the outside of a package.

Description

technical field [0001] The invention relates to a resin circuit board chip flip-chip rectangular heat dissipation block packaging structure. It belongs to the technical field of semiconductor packaging. Background technique [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very small, and at the same time, the metal-based...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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