Packaging structure of inversed T-shaped locking hole heat-dissipation block of inner pin embedded chip

Abstract

The invention relates to a packaging structure of the inversed T-shaped locking hole heat-dissipation block of an inner pin embedded chip, comprising a chip (3), inner metal pins (4), a metal lug (10), conducting or non-conducting heat-conduction bonding substance I (2) and a plastic package body (8), wherein the inner metal pins (4) are borne below the chip, the metal lug (10) is used for interconnecting a signal from the chip to the inner metal pins, and the conducting or non-conducting heat-conduction bonding substance I (2) is arranged between the chip (3) and each inner metal pin (4); and the inner metal pins (4) are embedded into the plastic package body (8). The packaging structure is characterized in that a heat-dissipation block (7) is arranged above the chip (3) and is provided with a locking hole (7.1); and conducting or non-conducting heat-conduction bonding substance II (6) is embedded between the heat-dissipation block (7) and the chip (3). In the packaging structure, the heat-dissipation block is added above the chip to dissipate high heat, and has strong heat dissipation capability, thus the heat of the chip can be quickly conducted out of the package body.

Description

technical field [0001] The invention relates to a package structure and a package method of a cooling block with internal pins embedded in chip flip-chip T-shaped locking holes. It belongs to the technical field of semiconductor packaging. Background technique [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet (such as figure 1 and figure 2 As shown), so the effective area and volume of the metal-based island are very small, an...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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