Wafer protecting device of loader

Abstract

The invention relates to a wafer protecting device of a loader, comprising a main shaft, a bearing seat, a sucker fixed on the lower end of the bearing seat, a cover plate which is fixed to the lower end face of the sucker in a sealing manner and a ceramic plate which is absorbed on the lower end face of the cover plate. The sucker is symmetrically provided with two lock tongues along the radial direction, the lock tongues are matched with the sucker in a sliding mode, and an offsetting spring is arranged between the inner end of each lock tongue and the sucker. The ceramic plate is provided with a drop-preventing protective ring, the lower end of the drop-preventing protective ring is provided with an inner flange for supporting the ceramic plate, and the inner side of the upper end of the drop-preventing protective ring is provided with a groove blocked at the outer end of each lock tongue. The invention has simple structure as well as fast and convenient operation; and by adopting the device, the reliability of the work of polishing equipment can be greatly improved without reducing the production efficiency, and economic loss can be remarkable and effectively reduced for enterprises.

Description

technical field [0001] The invention relates to a carrier wafer protection device, in particular to a vacuum adsorption carrier wafer protection device used on special polishing equipment in the semiconductor industry. Background technique [0002] In the single-side polishing process of wafers, the semiconductor industry uses special polishing equipment. The carrier wafer disk of this type of equipment is generally vacuum-adsorbed on the carrier. During the polishing process, due to power failure and other reasons, the vacuum air circuit will fail, resulting in a decrease in vacuum, which may cause the ceramic wafer disc to fall off, causing greater damage to the wafer, or even scrapping it. It may bring losses of tens of thousands of yuan to the enterprise. In order to protect the wafer from damage when the gas path fails, effective measures should be taken to prevent the wafer disc from falling off, so as to further improve the reliability of the wafer polishing equipmen...

AI Technical Summary

Problems solved by technology

During the polishing process, due to power failure and other reasons, the vacuum air circuit will fail, resulting in a decrease in vacuum, which may cause the ceramic wafer disc to fall off, causing greater damage to the wafer, or even scrapping it. The loss of tens of thousands of yuan may be brought to the enterprise

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