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Electronic device formed by molding, method and mold for manufacturing the same, electronic application by using the same

An electronic device and sound transmission technology, which is applied to electrical equipment shells/cabinets/drawers, emergency protection devices, and other household appliances, etc., can solve problems such as reducing the utilization rate of internal space, damage to electronic devices, and increasing the size of electronic devices

Inactive Publication Date: 2010-08-18
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, such a manufacturing method increases the size of the electronic device, reduces the utilization rate of the internal space, and is not conducive to the miniaturization of the product
[0012] In addition, since the wires are bundled, the electronic device is vulnerable to damage from external forces such as wire bending or push-pull movement

Method used

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  • Electronic device formed by molding, method and mold for manufacturing the same, electronic application by using the same
  • Electronic device formed by molding, method and mold for manufacturing the same, electronic application by using the same
  • Electronic device formed by molding, method and mold for manufacturing the same, electronic application by using the same

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Embodiment Construction

[0052] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Those skilled in the art should understand that without departing from the spirit and scope of the present invention, various additions, substitutions and deletions can be made, and those skilled in the art can easily come up with other examples falling within the spirit of the present invention embodiments or additional inventions. Accordingly, all such additions, substitutions and deletions are intended to be included within the scope of the claims and / or their equivalents.

[0053] figure 1 is a sectional perspective view partially showing an electronic device manufactured by molding according to an exemplary embodiment of the present invention. figure 2 is schematically shown figure 1 An exploded persp...

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PUM

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Abstract

An electronic device manufactured by molding according to an aspect of the invention may include a board having a circuit component mounted thereon; a cable transmitting a signal from an external source to the board; a clamp securing the cable to the board; and a casing molding unit integrally molded with the board and the clamp from a resin material to define the outer appearance.

Description

[0001] This application claims priority from Korean Patent Application No. 10-2009-0012410 filed with the Korean Intellectual Property Office on February 16, 2009, the disclosure of which is hereby incorporated by reference. technical field [0002] The present invention relates to an electronic device manufactured by molding, a method and a mold for manufacturing the same, and an electronic device using the same, and more particularly, to an electronic device integrally molded with a board using a resin material, mounted on a board There is a drive circuit assembly that supplies a signal when pressed and then returns to its original state. Background technique [0003] Generally, an electronic device in which wires or circuit components mounted on a board are formed is manufactured in such a manner that the circuit components or wires are first connected and then an upper case and a lower case are bonded to each other. [0004] Using the electronic device having the above-m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00B29C45/14B29C45/26B29C33/14H04R1/10
CPCB29C45/14065B29L2031/3481H01H9/0228H01H2221/09H01H9/0271B29C45/14655H01H2009/0285B29L2031/3061H01H9/04H05K5/065B29C2045/14147H05K5/00G11B20/00
Inventor 李得雨成宰硕李大揆梁泰锡全英镐
Owner SAMSUNG ELECTRO MECHANICS CO LTD