Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus
A brittle material substrate, laser scribing technology, used in fine working devices, laser welding equipment, glass cutting devices, etc., can solve problems such as asymmetry, position offset, thermal distribution asymmetry, etc.
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no. 1 approach ）
[0081] Hereinafter, embodiments of the present invention will be described based on the drawings. figure 1 It is a schematic configuration diagram of a laser scribing device LS1 as one embodiment of the present invention. figure 2 to show figure 1 A diagram of the structure of the control system of the laser scribing device LS1. image 3 A diagram illustrating the structure of an optical holder incorporating an optical system for adjusting the beam spot.
[0082] First, based on figure 1 The overall structure of the laser scribing device LS1 will be described.
[0083] Along a pair of guide rails 3 and 4 arranged in parallel on the horizontal platform 1, there are figure 1 The sliding table 2 that reciprocates in the front and back direction of the paper (hereinafter referred to as the Y direction). Between the two guide rails 3, 4, a lead screw (スクリュネネジ) 5 is disposed along the Y direction, on which a pillar 6 fixed to the slide table 2 is screwed, and a motor (not ...
no. 2 approach ）
[0117] Figure 9 It is a schematic configuration diagram of a laser scribing device LS2 according to another embodiment of the present invention. Figure 10 to show Figure 9 A diagram of the structure of the control system of the laser scribing device LS2. right with figure 1 , figure 2 The same structures are assigned the same symbols and descriptions of common parts are omitted.
[0118] The laser scribing device LS2 has the above-mentioned laser scribing device LS1 as a basic structure, and further includes a camera 61 that moves along the planned scribing line S with the planned scribing line S set on the substrate A as the center of the imaging area. Line S reflects the surface of substrate A. The camera 61 is supported by the arm 24 in a freely movable position. Arm 24 consists of Figure 10 The shown camera drive unit 63 controls. For the camera 61 , the most suitable camera 61 is selected from infrared cameras, optical cameras (visible light cameras), X-ray ...
no. 3 approach ）
[0130] In the first to second embodiments, the irradiation area adjustment unit is installed on the side of the laser scribing device to make the heat distribution of the substrate A after laser irradiation centered on the planned scribing line to be left-right symmetrical, while in the third embodiment In the method, an irradiation area adjustment unit is installed on the side of the substrate A to adjust the heat distribution of the substrate A after laser irradiation to be left-right symmetrical across the line to be scribed.
[0131] Figure 12 It is a figure explaining the scribing method which attaches the irradiation area adjustment unit to the board|substrate A side of this invention, and performs scribing. In this example, a coating region C is formed in a region serving as a unit display substrate U of the mother substrate A (mother substrate).
[0132] In addition, the provisional coating 71 is formed in advance, and the distance d1 between the planned scribing lin...
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Abstract
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Application Information
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