Side light-emitting type light-emitting assembly encapsulating structure and manufacturing method thereof
A technology of light-emitting components and packaging structures, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as poor light shape and light field
Inactive Publication Date: 2012-06-13
ZHANJING TECH SHENZHEN +1
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Problems solved by technology
Can effectively use the intensity of side light to solve the problems of poor light shape and light field
Method used
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[0070] The present invention provides a packaging structure of a side-emitting light-emitting component and a manufacturing method thereof. In order to thoroughly understand the present invention, a detailed structure and process thereof will be provided in the following description. Obviously, the practice of the invention is not limited to specific details familiar to those skilled in the art of semiconductor light-emitting devices. On the other hand, well-known components or steps have not been described in detail so as not to unnecessarily limit the invention. The preferred embodiments of the present invention will be described in detail as follows, but in addition to these detailed descriptions, the present invention can also be widely used in other embodiments, and the scope of the present invention is not limited, it is defined in the appended claims prevail.
[0071] The invention discloses a packaging structure of a side-emission light-emitting component, which inclu...
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The invention relates to a side light-emitting type light-emitting assembly encapsulating structure and a manufacturing method thereof. The side light-emitting type light-emitting assembly encapsulating structure comprises a base plate, a semiconductor light-emitting assembly, a transparent die member and an opaque die member, wherein the base plate is provided with a first surface and a second surface; the first surface is provided with a first electrode and a second electrode; the second surface is provided with a third electrode and a fourth electrode; the first electrode is electrically connected with the third electrode, and the second electrode is electrically connected with the fourth electrode; the semiconductor light-emitting assembly is fixed to the first surface of the base plate, a P electrode of the semiconductor light-emitting assembly is electrically connected with the first electrode, and an N electrode of the semiconductor light-emitting assembly is electrically connected with the second electrode; the appearance of the transparent die member approximately forms a quarter of ellipsoid, the transparent die member is provided with a joint surface and a light-emitting surface, and the joint surface is used for covering the semiconductor light-emitting assembly; and the opaque die member covers the transparent die member so that the appearance of the light-emitting assembly encapsulating structure approximately forms a cuboid. The side light-emitting type light-emitting assembly encapsulating structure is manufactured by utilizing a pouring conversion mouldingprocess.
Description
technical field [0001] The invention relates to a packaging structure of a light-emitting component and a manufacturing method thereof, in particular to a packaging structure of a side-emitting light-emitting component and a manufacturing method thereof. Background technique [0002] Nowadays, semiconductor light-emitting components usually have a light-emitting form of front-emitting (top view or top-emitting) or side-emitting (side view or side-emitting). Semiconductor light-emitting components that emit light from the side usually have problems such as insufficient illumination and insufficient stress that the packaging structure can withstand. Therefore, many inventions and researches have proposed many improved methods for related technologies of semiconductor light-emitting components that emit light from the side. In addition, most semiconductor light-emitting chips are packaged by means of transfer-molding or dispensing. In comparison, the encapsulation method of p...
Claims
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IPC IPC(8): H01L25/075H01L21/56H01L33/00
CPCH01L24/97H01L2224/48227H01L2224/97
Inventor 郭子毅罗杏芬陈滨全
Owner ZHANJING TECH SHENZHEN