Cooling method of power-type diode and special cooling fin
A heat dissipation method and diode technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as ineffective effects, high processing costs, and increased internal space of components
Inactive Publication Date: 2012-05-02
镇江市东亚电子散热器有限公司
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Problems solved by technology
For power diodes, due to their special shape, ordinary chip radiators cannot be closely attached to the surface of the device.
The conventional processing method is to stamp the aluminum plate into a tube shape, and then press it on the diode. The processing cost is high and it is not easy to mass-produce. The other method is to increase the internal space of the component and let it cool naturally. cost
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[0013] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0014] A new heat dissipation method for power diodes, using a heat conductor to directly wrap the outside of the diode body, and use the heat conductor to dissipate heat. In this example, the heat conductor is a heat sink, and the heat sink is a cylindrical overall structure; heat conduction The inner wall matches the shape of the diode, so that the cylindrical heat conductor can be closely attached to the periphery of the diode; the outer wall of the cylindrical heat conductor is provided with a plurality of convex ribs 1 that are uniformly arranged in the axial direction around the cylindrical heat conductor , the length direction of the rib 1 is the same as the axial direction of the cylindrical heat conductor; a plurality of ribs form an air duct; The opening 3 in the axial direction of the body; the opening angle α of the opening 3 is les...
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The invention relates to a cooling method of a power-type diode. A heat conductor is directly packed outside a diode body and is used for cooling. The heat conductor is a cylindrical integral structure; the inner wall of the heat conductor is matched with the appearance of the diode, so that the cylindrical heat conductor can be tightly stuck to the periphery of the diode; the outer wall of the cylindrical heat conductor is provided with a plurality of ledges which are axially and evenly arranged around the cylindrical heat conductor; the length directions of the ledges are same as the axial direction of the cylindrical heat conductor; and the ledges form an air channel. The invention also relates to a special cooling fin realizing the cooling method. The cooling fin is a cylindrical integral structure; the inner wall of the cooling fin is matched with the appearance of the diode; the outer wall of the cylindrical cooling fin is provided with a plurality of ledges which are axially and evenly arranged around the cylindrical cooling fin; the length directions of the cooling fins are same as the axial direction of the cylindrical cooling fins; and the ledges form an air channel. Thetechnical scheme solves the cooling problems of the power-type diode and is simple and easy to apply, and the required cooling fins can be manufactured by using traditional materials and equipment.
Description
technical field [0001] The invention belongs to the field of heat dissipation of electronic power devices, in particular to a heat dissipation method for a power type diode and a special heat dissipation sheet. Background technique [0002] In the prior art, heat sinks are widely used, especially for some power electronic devices, chip heat sinks are widely used. For power diodes, due to their special shape, ordinary chip heat sinks cannot be closely attached to the surface of the device. The conventional processing method is to stamp the aluminum plate into a tube shape, and then press it on the diode. The processing cost is high and it is not easy to mass-produce. The other method is to increase the internal space of the component and let it cool naturally. cost. Contents of the invention [0003] In order to solve the above-mentioned problems existing in the prior art, the present invention proposes a new heat dissipation method for power diodes and a special heat sin...
Claims
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IPC IPC(8): H01L23/367H01L23/467
Inventor 杜斌杜小荣
Owner 镇江市东亚电子散热器有限公司