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Heat sink

一种散热装置、吸热部的技术，应用在冷却/通风/加热改造、电气元件、电固体器件等方向，能够解决散热模块散热负荷大、散热器散热效率不高、主处理器热量得不到及时散发等问题，达到使用安全可靠的效果

Inactive Publication Date: 2010-10-27
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the heat dissipation load of one heat dissipation module is too large, and the heat dissipated by the main processor cannot be dissipated in time, while the heat dissipation efficiency of the other heat sink is not high.

Method used

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Embodiment Construction

[0011] see figure 1 , which shows the heat dissipation device in a preferred embodiment of the present invention, the heat dissipation device is mainly used for a first heating electronic component 21 on the circuit board 20, a second heating electronic component 23 and respectively arranged on the first 1. Other electronic components 25 around the second heat-generating electronic components 21 and 23 dissipate heat. In this embodiment, the circuit board 20 is a video image card (VGA), the first and second heating electronic components 21, 23 are GPUs, and the power of the first heating electronic component 21 is higher than that of the second heating electronic component 23. High power.

[0012] The heat dissipation device includes a back plate 10 located below the circuit board 20, a bracket 30 located above the circuit board 20, a temperature equalizing panel fixed on the bracket 30 and attached to the first and second heating electronic components 21, 23 respectively. p...

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Abstract

The invention provides a heat sink for radiating a first heating element and a second heating element on a circuit board. The heat sink comprises a temperature equalizing plate attached to the first heating element and the second heating element; the temperature equalizing plate comprises a sealed casing, a capillary structure in the casing, and operating liquid; a connecting plate is attached to the lower surface of the temperature equalizing plate; and a plurality of fixed parts pass through the circuit board and are matched with the connecting plate so as to fix the temperature equalizing plate on the circuit board. Compared with the prior art, the temperature equalizing plate is fixed on the circuit board through the connecting plate so as to avoid damage to the capillary structure owing to screw holes arranged on the temperature equalizing plate or avoid leakage of the operating liquid in the temperature equalizing plate or avoid external air entering the temperature equalizing plate and other harms, thus the temperature equalizing plate can be more safely and reliably used.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device which can be used for heat dissipation of electronic components. Background technique [0002] With the continuous development of computer technology in recent years, some add-on cards such as video graphics cards (VGA cards) gradually adopt two separate processors to improve their computing speed and operating capabilities. The two processors usually consist of a main processor and an auxiliary processor. In the industry, two identical cooling modules are usually used to dissipate heat for the two processors respectively. The power of the main processor is higher than that of the auxiliary processor, and it generates more heat than the auxiliary processor during operation. Therefore, the heat dissipation module in contact with the main processor has a higher temperature, while the heat dissipation module in contact with the auxiliary processor has a higher ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/427H01L23/40H01L23/467
CPCH01L23/467H01L23/427H01L2924/0002H01L2924/00
Inventor 彭学文李君海
Owner FU ZHUN PRECISION IND SHENZHEN
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