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Light-emitting diode module and production method thereof

A technology of light-emitting diodes and manufacturing methods, applied to semiconductor devices of light-emitting elements, light sources, optical elements for changing the spectral characteristics of emitted light, etc., which can solve the problems of increased production costs, unsuitable assembly of light-emitting diodes, limited design flexibility, etc. question

Inactive Publication Date: 2010-12-01
LIGHT OCEAN TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing production machines are not suitable for assembling LEDs that include bulky heat sinks or heat sinks with heat dissipation fins. Therefore, manufacturers must design additional suitable production machines, which increases production costs.
In addition, the appearance of the heat sink is mostly fixed shape, so the shape of the heat sink limits the design flexibility of the final product appearance, especially the bulky heat sink or the heat sink with fins

Method used

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  • Light-emitting diode module and production method thereof
  • Light-emitting diode module and production method thereof
  • Light-emitting diode module and production method thereof

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Embodiment Construction

[0039] Please refer to Figure 1a as well as Figure 1b , illustrating the LED module 1 of the present invention, wherein Figure 1a is a cross-sectional side view of the LED module 1 of the present invention, Figure 1b It is a top view of the LED module 1 of the present invention with the light-transmissive packaging component 14 removed. The LED module 1 of the preferred embodiment of the present invention includes a carrier board 11 , at least one substrate 12 , at least one LED 13 and at least one light-transmitting packaging component 14 . The carrier board 11 has a loading area 111 and a forming area 112 , wherein the forming area 112 can be arbitrarily processed into a specific shape according to design requirements. The substrate 12 is disposed on the carrying area 111 of the carrier 11 . The substrate 12 has at least one circuit layer, for example, the circuit layer includes conductive contacts 121 . In an embodiment, the substrate 12 can be a copper foil substrat...

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Abstract

The invention discloses a light-emitting diode module and a production method thereof. The production method comprises the following steps of: providing a support plate provided with a supporting area and a forming area; arranging at least one substrate provided with at least one circuit layer in the supporting area of the support plate; arranging at least one light-emitting diode in the supporting area of the support plate; electrically connecting the circuit layers of the substrates of the light-emitting diodes; packaging the light-emitting diodes and at least partial circuit layers by at least one transmitting package assembly; and processing the forming area of the support plate into the required shape. The support plate not only can be used as a heat-radiating element, but also is easily processed into various designed shapes. Therefore, the method for producing the light-emitting diode has lower production cost and better heat-radiating effect and shape.

Description

technical field [0001] The invention relates to a light-emitting diode module and a manufacturing method thereof, in particular to a light-emitting diode module suitable for being processed into various shapes and a manufacturing method thereof. Background technique [0002] Light-emitting diodes (light-emitting diodes, LEDs) have the advantages of small size, long service life, and power saving. Therefore, light-emitting diodes are widely used in lighting fixtures, traffic signs, and decorations. However, the problem of heat dissipation has always been a problem to be overcome by light-emitting diodes, especially high-power light-emitting diodes. [0003] In the existing light-emitting diode module, after the light-emitting diode is packaged, the packaged light-emitting diode is arranged on the heat sink. As the power of the light-emitting diode increases, the volume of the heat sink also increases to increase the heat dissipation effect. However, the existing production ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V23/00F21V29/00F21V9/10F21V7/20H01L33/00F21Y101/02F21V9/40F21V29/505
CPCH05K1/021H01L33/54H01L33/647F21K9/00H01L33/642H01L33/60H01L2933/0058H01L2224/48091F21V29/505F21V29/75F21V29/763H01L2924/00014
Inventor 莊永富林己智
Owner LIGHT OCEAN TECH CORP
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