Heat sink, its manufacturing method, and heat sink fan

Abstract

The invention provides a heat sink, its manufacturing method, and a heat sink fan, particularly to a heat sink which effectively transmits heat to a heat sink wing and has high cooling property and a fixing method for mounting a mounting member on the heat sink with a high strength. The heat sink has a plurality of radially extended heat radiating fins that are continuously annularly arranged on the cylindrical outer side of a cylindrical base part. The base part is formed in the shape of a cylinder with a central axis as the center. Moreover, the base part is formed in a solid structure. The heat sink is cut such that a roughly cylindrical cooled object contacting portion projects toward an axial direction from the end surface of the heat sink. An annular groove is cut in the contact surface of the cooled object contacting portion along the outer peripheral end. The mounting member is inserted to fit with the outer circumferential surface of the cooled object contacting portion, and a pressurizing section is pressurized over the entire circumference by a pressing machine. The pressurizing section is plastically deformed outward in the diameter direction, and the mounting member is pinched and fixed.

Description

[0001] This application is a divisional application of the Chinese invention patent application with the application date of January 15, 2008, the title of the invention is "radiator, radiator fan and method for manufacturing the radiator", and the application number is 200810003442.6. technical field [0002] The present invention relates to a heat sink that conducts heat from electronic components, a heat sink fan, and a method of manufacturing the heat sink. In particular, the present invention relates to a heat sink for cooling objects to be cooled such as electronic components including MPUs. This application is related to the following Japanese application. With regard to designated countries that have accepted the incorporation by document reference, the contents described in the following applications are incorporated by reference into this application and made a part of this application. [0003] 1. The filing date of Japanese Patent Laid-Open No. 2007-005490 was Jan...

AI Technical Summary

Problems solved by technology

However, if such a conventional method is used, not only a lot of man-hours are required, but also heating or cooling of the heat sink will cause a large temperature change, so the strength of the heat sink itself may be reduced.

In addition, if the operating temperature range of the heat sink is higher than the expected temperature, the core may fall off due to thermal expansion on the heat sink.

[0016] Thus, in the structure disclosed in the above-mentioned Patent Document 1, in consideration of availability, cost, reliability and production efficiency, there is a problem

[0017] In addition, as described above, in order to improve the cooling performance of the heat sink, it is necessary to firmly attach the heat sink to the MPU. However, in the fixing method shown in Patent Document 2, only the Since it is fixed by fitting with the notch, the rotational strength around the central axis of the heat sink is low

In addition, depending on the processing accuracy of the notch and the support, there may be play between the notch and the support in the axial direction with the central axis as the axis.

That is, high reliability cannot be obtained by the fixing method disclosed in Patent Document 2

[0018] In addition, in conventional methods other than the method disclosed in Patent Document 2, a large amount of man-hours for installation will be generated.

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