Luminescent module, and its manufacturing method

Abstract

Provided are a luminescent module, which is improved in the heat radiation and in the contact between a sealing resin for sealing a light emitting element and another member, and a method for manufacturing the module. The luminescent module (10) comprises a metal substrate (12), a recess (18) formed by recessing the upper face of the metal substrate (12) partially, a light emitting element (20) housed in the recess (18), and a sealing resin (32) for covering the light emitting element (20). On the upper face of a metal substrate (40) in the region enclosing the recess (18), moreover, there is formed a rising portion (11), with which the sealing resin (32) comes into contact, thereby to improve the contact strength between the sealing resin (32) and the metal substrate (12).

Description

technical field [0001] The invention relates to a light-emitting component and a manufacturing method thereof, in particular to a light-emitting component equipped with a high-brightness light-emitting element and a manufacturing method thereof. Background technique [0002] Semiconductor light-emitting devices represented by LEDs (Light Emitting Diodes) have been used in traffic signals and automobile lights due to their long service life and high visibility. In addition, LEDs have also been used as lighting equipment. [0003] When LEDs are used as lighting equipment, brightness is not enough with only one LED, so many LEDs are mounted in one lighting equipment. However, LEDs dissipate a large amount of heat when they emit light. Therefore, after mounting the LEDs on a mounting substrate made of a resin material with poor heat dissipation, or encapsulating each LED with resin, the heat dissipated from the LEDs may not be sufficient. The problem of premature degradation o...

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Problems solved by technology

Therefore, when a high-brightness LED through which a high current of 200 mA or more flows is used as the light-emitting element 15 to emit light, the structure described in Japanese Patent Application Laid-Open No. 2006-100753 may not be able to dissipate heat sufficiently.

[0006] In addition, since the sealing resin used to seal the light-emitting element 15 does not have sufficient adhesion to other members (such as the substrate), there is a risk that the sealing resin will peel off from the substrate due to thermal stress caused by temperature changes during use.

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