Resin molding method and die device for resin molding

A technology for resin molding and molds, which is applied in the field of improvement of mold devices for resin molding, which can solve problems such as hindering heat absorption of molds and difficulty in forming resin molded products, and achieve the effect of suppressing air holes

Inactive Publication Date: 2013-05-15
HONDA LOCK MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the content disclosed in the above-mentioned Patent Document 1, due to the suction effect when the mold core is separated, the design surface may also be released from the cavity wall surface. Externally communicated vent holes so that the void does not become negative pressure, however there may be a suction effect due to the speed of movement of the mold core during the separation
Furthermore, in the content disclosed in the above-mentioned Patent Document 1, since there is no pressing force for pressing the resin against the wall surface of the cavity on the design surface side, the mold will be released naturally as the resin cools and shrinks, preventing the mold from absorbing heat.

Method used

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  • Resin molding method and die device for resin molding
  • Resin molding method and die device for resin molding
  • Resin molding method and die device for resin molding

Examples

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Embodiment 1

[0018] Figure 1 ~ Figure 4 One embodiment of the invention is shown.

[0019] First, in figure 1 Among them, the resin molded product 5 is formed, for example, in a flat plate shape, and one surface is used as a designed surface 6 and the other surface opposite to the designed surface 6 is used as a non-designed surface 7. The protrusion 5a protruding from the surface 7 is designed.

[0020] The resin molded product 5 consists of figure 2 The mold device 8 for resin molding shown is molded, but since the wall thickness of the portion of the resin molded product 5 where the protrusion 5a is provided is thicker than other parts, when the resin molded product 5 is molded, the protrusion 5a The resin molding method according to the present invention is executed in order to suppress generation of air holes in the part of the portion 5a, and the resin molding mold device 8 is configured to be suitable for performing the resin molding method.

[0021] The mold device 8 for resi...

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PUM

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Abstract

A resin-molding mold device is provided for carrying out the resin molding process to mold the resin molded article, wherein when cooling after charging a molten synthetic resin into a cavity (14) and maintaining the pressure, a movable core (11) is urged to the side in which the capacity of the cavity (14) is decreased. This enables a resin molded article having a proper shape to be reliably molded by preventing a design surface from parting from a cavity wall surface when die-molding the resin molded article by charging a molten synthetic resin into a cavity formed from a plurality of dies.

Description

technical field [0001] The present invention relates to a resin molding method for molding a resin molded article by filling a cavity formed by a plurality of molds with molten synthetic resin, and an improvement in a resin molding mold device for performing the resin molding method. Background technique [0002] It is known in Patent Document 1 that when molding a resin molded product, the heat transfer between the resin surface and the mold core is improved by separating the mold core on the opposite side of the design surface from the resin surface to form a gap. Therefore, the portion facing the void preferentially generates pores, and as a result, the pores on the design surface are suppressed. [0003] Patent Document 1: Japanese Patent No. 3512595 [0004] However, in the content disclosed in the above-mentioned Patent Document 1, due to the suction effect when the mold core is separated, the design surface may also be released from the cavity wall surface. In that c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/56B29C45/26
CPCB29C2045/5645B29C45/572
Inventor 野田雄一郎
Owner HONDA LOCK MFG CO LTD
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