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Cutting device and cutting method for liquid crystal glass substrate after cutting of paired boxes

A liquid crystal glass substrate and cutting device technology, applied in glass cutting devices, glass manufacturing equipment, optics, etc., to achieve the effect of improving cutting efficiency

Inactive Publication Date: 2013-03-27
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a cutting device and a cutting method for cutting the liquid crystal glass substrate after the box is aligned, so as to solve the problem of cutting only in one fixed direction, realize the ability to cut back and forth from two directions, and improve the cutting efficiency

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  • Cutting device and cutting method for liquid crystal glass substrate after cutting of paired boxes
  • Cutting device and cutting method for liquid crystal glass substrate after cutting of paired boxes
  • Cutting device and cutting method for liquid crystal glass substrate after cutting of paired boxes

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Embodiment Construction

[0018] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0019] Embodiments of the present invention firstly provide a cutting device for cutting a cell-aligned liquid crystal glass substrate, image 3 It is a schematic structural view of an embodiment of a cutting device for cutting a cell-aligned liquid crystal glass substrate according to the present invention, as image 3 Shown, the cutting device of the present embodiment and figure 1 Compared with the existing cutting device shown, the main difference is that, figure 1 The existing cutting device shown is respectively equipped with a cutting head on the Y-direction support of the upper and lower cutting parts, and the cutting device of this embodiment adds another one on the Y-direction support of the upper and lower cutting part on this basis. There is a cutting head with the cutting head reversed.

[0020] The str...

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Abstract

The invention discloses a cutting device and a cutting method for a liquid crystal glass substrate after cutting of paired boxes, wherein the cutting device comprises an upper cutting portion and a lower cutting portion, the upper cutting portion and the lower cutting portion respectively comprise a first bracket arranged horizontally and a first traveling driving module for driving the first bracket to move in the direction of X, and further comprise a second bracket and a second traveling driving module for driving the second bracket to move in the direction of Y, the second bracket, in the vertical direction, is provided with a first cutting head and a third traveling driving module for driving the first cutting head to move in the direction of Z, and is further provided with a second cutting head directionally opposite to the first cutting head and a fourth traveling driving module for driving the second cutting head to move in the direction of Z. According to the invention, cutting in two directions, i.e. advancing and returning, can be realized by the cutting device, thereby enhancing the cutting efficiency greatly.

Description

technical field [0001] The invention relates to liquid crystal manufacturing technology, in particular to a cutting device and a cutting method for cutting and aligning liquid crystal glass substrates. Background technique [0002] During the manufacturing process of a Liquid Crystal Display (hereinafter referred to as LCD), a cutting device needs to be used to cut a whole piece of liquid crystal glass substrate to form liquid crystal screens meeting different specifications. figure 1 It is a structural schematic diagram of a cutting device for cutting a cell-aligned liquid crystal glass substrate in the prior art, as figure 1 As shown, the current cutting device includes an upper cutting part for cutting the upper substrate of the liquid crystal glass substrate and a lower cutting part for cutting the lower substrate of the liquid crystal glass substrate, and the upper cutting part and the lower cutting part are simultaneously synchronously cutting the upper and lower layer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/023G02F1/1333
Inventor 孙凯文张彭
Owner BOE TECH GRP CO LTD