Workpiece vacuum sputtering method and device

Abstract

The invention relates to a workpiece vacuum sputtering method which is applied to a vacuum sputtering device provided with two communicated chambers. The vacuum sputtering device comprises a first chamber, a second chamber, a first lifting frame arranged in the first chamber, and a second lifting frame arranged on the second chamber. The method comprises the following steps: placing a first workpiece on the first lifting frame in the first chamber, and preheating the first workpiece; exchanging the first lifting frame in the first chamber with the second lifting frame in the second chamber; sputtering the preheated first workpiece in the second chamber; exchanging the second lifting frame in the first chamber with the first lifting frame in the second chamber; and taking out the sputteredfirst workpiece from the first chamber. The first chamber is used for preheating the workpiece, the second chamber is used for sputtering, and when the workpiece is subject to sputtering in the second chamber, the workpiece also can be taken, placed and preheated simultaneously in the first chamber, thus the yield is improved, and target materials in the second chamber is difficult to oxidize.

Description

technical field [0001] The invention relates to a sputtering method and device, in particular to a workpiece vacuum sputtering method and device. Background technique [0002] General consumer electronic products such as mobile phones or computers can use physical vapor deposition (Physical Vapor Deposition; PVD) process to decorate the casing of the coating. This process uses a single chamber for reaction. Then close the cavity and then vacuumize it. After the vacuum state is formed in the cavity, the shell is heated, and then the shell is sputtered. After the sputtering is completed, the cavity needs to be opened to take out the sputtered shell. At this time, the cavity loses its vacuum state, and the target in the cavity will be oxidized in contact with the air, which will affect the next sputtering process. Effect. And when the next process is carried out, the chamber needs to be evacuated from atmospheric pressure to vacuum again, and then the shell is preheated and s...

AI Technical Summary

Problems solved by technology

After the sputtering is completed, the cavity needs to be opened to take out the sputtered shell. At this time, the cavity loses its vacuum state, and the target in the cavity will be oxidized in contact with the air, which will affect the next sputtering process. Effect

And when the next process is carried out, the cavity needs to be evacuated from atmospheric pressure to vacuum again, and then the shell is preheated and sputtered in sequence. This process is time-consuming, resulting in low yield

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