Magnetron sputtering target and magnetron sputtering device adopting same

Abstract

The invention relates to a magnetron sputtering device which comprises a shielding cover, a substrate bearing seat and a magnetron sputtering target, wherein the shielding cover is provided with a first cavity, and the substrate bearing seat, a substrate and the magnetron sputtering target are positioned in the first cavity; the substrate bearing seat is arranged opposite to the magnetron sputtering target, the substrate is installed on the substrate bearing seat, and the magnetron sputtering target is pivoted on the inner wall of the shielding cover; the magnetron sputtering target comprises a target seat, at least one target material, a plurality of magnetic cores and a magnetic core translation mechanism, and the target material is fixed on the target seat; the plurality of magnetic cores are fixed on the magnetic core translation mechanism; the magnetic properties of every two adjacent magnetic cores are opposite; the magnetic core translation mechanism comprises a supporting plate, a plurality of roll shafts and transmission strips, and the edge of the supporting plate is fixed on the target seat and is parallel with the target material; the plurality of roll shafts are arranged on the supporting plate and can rotate relative to the supporting plate; the transmission strips are arranged around the plurality of roll shafts and the supporting plate; and the magnetic core translation mechanism can drive the plurality of magnetic cores to translate relative to the target material. The invention also provides a magnetron sputtering target.

Description

technical field [0001] The invention relates to a magnetron sputtering device, in particular to a magnetron sputtering target for vacuum coating and a magnetron sputtering device using the magnetron sputtering target. Background technique [0002] The existing vacuum coating is generally by emitting Ar + Particles hit the coating material in the vacuum chamber, so that the atoms of the material are separated from the heating source and hit the surface of the object to be coated to form a film layer. [0003] Magnetron sputtering target is one of the important equipment for vacuum coating. In the existing magnetron sputtering target, the magnetic core used is fixed relative to the coating material and the substrate to be coated. Due to the performance difference between the magnetic cores, part of the Ar + Particles cannot be absorbed by the magnetic field and some are too concentrated in the magnetic field range, resulting in Ar + The particles are unevenly distributed ar...

AI Technical Summary

Problems solved by technology

In the existing magnetron sputtering target, the magnetic core used is fixed relative to the coating material and the substrate to be coated. Due to the performance difference between the magnetic cores, part of the Ar + Particles cannot be absorbed by the magnetic field and some are too concentrated in the magnetic field range, resulting in Ar + Particles are unevenly distributed around the magnetron sputtering target, which affects the quality of the coating on the one hand and reduces the utilization of the target on the other hand

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