Temperature sensor

Abstract

The present invention provides a temperature sensor which can restrain the effect of the thermoresistance of a substrate or a heat discharging plate and can be electrically insulated from a circuit on the substrate. The temperature sensor is provided with the following components: a heat conduction sheet (4) which is sandwiched between the electronic device (2) and a substrate (3) that is equipped with the electronic device (2) through a clinging state, and causes the heat of the electronic device (2) to the substrate (3); and a thermal sensitive component (5) which is equipped on the heat conduction sheet (4). Therefore, the heat conduction sheet (4) which closely clings on to the electronic device (2) efficiently transfers heat to the thermal sensitive component (5) without passing through the substrate (3). The effect of the thermoresistance of substrate (3) can be restrained for accurately measuring the temperature of the electronic device (2).

Description

technical field [0001] The invention relates to a temperature sensor capable of accurately measuring the temperature of electronic devices such as transistors. Background technique [0002] In the past, when measuring the temperature of electronic devices that generate heat, such as transistors, for example, by mounting a temperature sensor such as a chip thermistor on a substrate assembled with electronic devices or a heat sink mounted on the electronic device, heat is released through the substrate or board to measure the temperature of electronic components. That is, in a power transistor or a power FET, etc., in order to protect it from damage due to temperature rise, the junction temperature is measured by an installed temperature sensor, and when it becomes above a predetermined temperature, control is performed according to the temperature, such as limiting or stopping operation. Therefore, a temperature sensor is installed near these electronic devices on a mounting...

AI Technical Summary

Problems solved by technology

[0006] That is, the prior art described above has the problem of estimating the temperature of the electronic device by assembling a temperature sensor on a substrate mounted with an electronic device or a heat radiation plate on which the electronic device is mounted, and measuring the temperatures of the substrate and the heat radiation plate with the temperature sensor. However, it is still difficult to accurately measure the junction temperature due to deviations caused by the influence of the thermal resistance of the substrate or heat sink

In addition, when the temperature sensor is mounted on the same substrate on which the electronic components are mounted, there is a problem of high cost of the temperature detection circuit in order to electrically insulate the large current circuit or the inverter circuit formed on the substrate.

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