Radial verticality detection platform

Abstract

The invention relates to a radial verticality detection platform for detecting the radial verticality of a single-wafer rod in photovoltaic industry. The radial verticality detection platform comprises a bottom plate, (10), a dial (11), a pillar (2) with a calibrated scale (2-1), a depth measuring scale (7) and an indexing table (8), wherein the lower end of the pillar (2) is provided with a base (1); the base (1) is fixed on the bottom plate (10); the dial (11) is rotatably supported on the bottom plate (10); the depth measuring scale (7) and the indexing table (8) are movably arranged on the pillar (2); and the depth measuring scale (7) is arranged below the indexing table (8). The invention not only ensures the vertical precision of the single-wafer rod but also ensures the accuracy of alignment of the single-wafer rod and does not need to detect circular runout for the second time.

Description

technical field [0001] The invention relates to a radial perpendicularity detection platform, which is used for detecting the radial perpendicularity of a single wafer rod in the photovoltaic industry. Background technique [0002] At present, most photovoltaic companies have raised their quality requirements to a new level. Cell companies have higher requirements for silicon wafer manufacturing, and the processing of defective silicon wafers has also been reduced from the previous acceptance to chipping and small side lengths. One category, the produced unrolled sheets are not acceptable. There are two sources of unrolled and eccentric: one is the eccentricity during the bonding process of the round rod. After that, it will be directly cut on the machine; the second is that it occurs during the line opening process. Since the equipment is imported, errors in procedures and operations will sometimes have an impact. [0003] Round rod bonding is the first process in the sili...

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Problems solved by technology

[0002] At present, most photovoltaic companies have raised their quality requirements to a new level. Cell companies have higher requirements for silicon wafer manufacturing, and the processing of defective silicon wafers has also been reduced from the previous acceptance to chipping and small side lengths. One category, the produced unrolled sheets are not acceptable. There are two sources of unrolled and eccentric: one is the eccentricity during the bonding process of the round rod. Then cut directly on the machine; the second is generated during the line opening process, because the equipment is imported, so the program and operation errors sometimes have an impact

[0003] Round rod bonding is the first process in the silicon wafer manufacturing workshop. The improvement of the yield of silicon wafers must start from this post. Now all photovoltaic companies produce square rods through wire square cutting; so the round rods are bonded to On the crystal support, ensuring the bonding accuracy of the round rod is the first element. After the round rod is bonded, the circular runout is detected by the one-way dial indicator. Therefore, the centering accuracy cannot be guaranteed for the eccentric and inclined crystal rod, which affects the direction. Rod yield

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