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Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology are applied in the directions of printed circuit components, electrical connection printed components, and the formation of printed component electrical connections, which can solve the problems of double-sided circuit boards with many processes and complicated costs, and achieve fewer manufacturing processes and lower production costs. The effect of high efficiency and low cost

Active Publication Date: 2013-10-30
SHANDONG HANFANG BIOTECH CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is to provide a single-sided circuit board with greatly reduced Production process and cost of circuit board production method

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0020] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] The circuit board production method provided by the present invention is aimed at the production of circuit boards that cannot communicate with each other and need to be provided with jumpers. The main production steps are as follows: providing a panel with a circuit layer; Set an opening at the corresponding place of the jumper bridge pad; attach the cover film after the opening to the circuit layer on the panel, so that the opening corresponds to the position of the above pad; the bonded cover film will need to be electrically connected If the conductive paste l...

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Abstract

The invention provides a circuit board and a manufacturing method thereof. The circuit board comprises a panel and a cover film, wherein a line layer is distributed on the panel; the cover film is attached on the line layer of the panel; the positions corresponding to pads which are used for configuring jumpers for bridge connection on the panel, of the cover film are provided with openings; conductive slurry layers are arranged among the openings in a silk-screen mode, wherein the openings are required to be subjected to electrical connection on the cover film; each conductive slurry layer is provided with an insulating layer in a silk-screen mode; and edges of the insulating layers exceed edges of the conductive slurry layer. According to the invention, the openings, the conductive slurry layers and the insulating layers are directly arranged on the cover film of the circuit board, so that the line layer which is provided with a plurality of lines and required to be provided with jumpers is arranged on one surface of the circuit board, thus avoiding the use of a double-faced circuit board, and greatly reducing the manufacturing process and cost.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board and a circuit board manufactured by the method. Background technique [0002] With the development of electronic technology, circuit boards are ubiquitous. Whether it is a rigid printed circuit board (PCB) or a flexible printed circuit board (FPC), they are widely used in electrical appliances in people's daily life. Electronic products are developing towards the trend of light, thin, short and small. In recent years, flexible printed circuit boards have been widely used in almost all high-tech electronic products. With the miniaturization of electronic products, various electronic components are also developing in the direction of miniaturization and miniaturization. Flexible printed circuit boards carrying various electronic components are of course no exception. The development trend of high-density flexible printed circuit boards is mainly reflected in the following aspects: 1. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/40
Inventor 廖从清宋莉丽
Owner SHANDONG HANFANG BIOTECH CO LTD
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