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Radiation curing adhesive and preparation method thereof

A radiation curing and adhesive technology, used in the field of radiation curing technology and coatings, can solve the problems of uncertain internal stress and poor durability, and achieve the effects of volume shrinkage compensation, improved adhesion and improved durability

Active Publication Date: 2013-08-28
康达新材料(集团)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The technical problem to be solved by the present invention is: for the adhesives of the existing radiation-curable free radical / cation compound system, there are problems such as uncertain internal stress and poor durability; the present invention provides a radiation-curable free radical type and The adhesive compounded by the cationic initiator system shows excellent bonding strength and weather resistance (mainly for high and low temperature, humidity), and can be widely used in the bonding of glass, iron, stainless steel, aluminum, ceramics, stone, etc. Good bonding strength and durability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] 1.1 Preparation of acrylate polymers,

[0072] Its method is:

[0073] aIn a four-neck flask equipped with a stirrer, a thermometer, a reflux condenser and a nitrogen inlet, add a certain amount of deionized water, part of the mixed monomer (accounting for 20% of the total mass of the mixed monomer), sodium bicarbonate, ten Sodium dialkylbenzene sulfonate (SDBS, accounting for 5% of the total mass of mixed monomers) and potassium persulfate (KPS, accounting for 0.1% of the total mass of mixed monomers). After feeding nitrogen, first pre-emulsify for 20 minutes, and then heat up to 75°C for reaction;

[0074] B after the reaction was carried out for 1.5 hours, gradually add the remaining 80% mixed monomers in a dropwise manner (the monomers are added dropwise at a constant speed, and the time is 3 hours), and add sodium dodecylbenzenesulfonate (account for 2% of the total mass of mixed monomers), continue to react for 2 hours;

[0075] c The prepared emulsion was demu...

Embodiment 2

[0096] 2.1 The preparation method of acrylate polymer is the same as embodiment 1

[0097] 2.2 The composition and preparation of the adhesive

[0098] Adhesive components:

[0099] (A) Polyurethane acrylate and epoxy acrylate compound 46%

[0100] (B) Mixed monomer 20.5%

[0101] Butyl Acrylate (4 parts), Isobornyl Acrylate (3.5 parts), Hexylene Glycol Divinyl Ether (1.5 parts)

[0102] (C) Epoxy resin (E51) 19%

[0103] (D) Radical photoinitiator 1.8%

[0104] (1173:184:TPO=1.0:0.8:1.3)

[0105] (E) Cationic photoinitiator (IHT-PI820) 1.0%

[0106] (F) Ethylene glycol 3.0%

[0107] (G) Various additives 2.0%

[0108] (H) Acrylate polymer 6.7%

[0109] 2.3 Adhesive preparation: the preparation method of the adhesive is the same as in Example 1

[0110] 2.4 Adhesive properties

[0111] Shear strength: 30MPa

[0112] Torque Strength: 43N·m

[0113] High and low temperature alternating test (low temperature -40°C, high temperature 85°C, 85% RH): basically no floweri...

Embodiment 3

[0115] 3.1 The preparation method of acrylate polymer is the same as in Example 1

[0116] 3.2 Composition and preparation of adhesive

[0117] Adhesive components:

[0118] (A) Polyurethane acrylate and epoxy acrylate compound 46%

[0119] (B) Mixed monomer 20.5%

[0120] Butyl Acrylate (4 parts), Isobornyl Acrylate (3.5 parts), Hexylene Glycol Divinyl Ether (1.5 parts)

[0121] (C) Epoxy resin (E51) 17%

[0122] (D) Radical photoinitiator 1.8%

[0123] (1173:184:TPO=1.0:0.8:1.3)

[0124] (E) Cationic photoinitiator (IHT-PI820) 1.0%

[0125] (F) Ethylene glycol 3.0%

[0126] (G) Various additives 2.0%

[0127] (H) Acrylic polymer 9.7%

[0128] 3.3 Adhesive preparation: the preparation method of the adhesive is the same as in Example 1

[0129] 3.4 Adhesive properties

[0130] Shear strength: 27MPa

[0131] Torque Strength: 35N·m

[0132] High and low temperature alternating test (low temperature -40°C, high temperature 85°C, 85% RH): no flowering

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Abstract

The invention provides a combined adhesive of a radiation curing radical and cationic initiator system, wherein a defined amount of acrylate high polymer is also used. Therefore, the problem of the prior art that the radiation curing adhesive of the radical / cationic cationic hybrid system has uncertain internal stress and poor durability can be solved; and the adhesive of the invention has excellent bonding strength and weather resistance (mainly for high / low temperature and humidity) and can be widely used for the bondings of materials such as glass, iron, stainless steel, aluminum, ceramic and stone. Another technical problem solved by the invention is to provide a preparation method of the combined radiation curing adhesive of the radical and cationic initiator system.

Description

technical field [0001] The invention relates to the technical field of radiation curing and the field of coatings, in particular to a UV radiation curing adhesive and a preparation method thereof. Background technique [0002] In the 1960s, Germany introduced the green technology of the first generation of UV coatings, which was initially applied in the wood coating industry. In the future, radiation curing technology will gradually expand from the single substrate of wood to the coating application of paper, various plastics, metals, stones, and even cement products, fabrics, leather and other substrates. [0003] Radiation curing (UV / EB curing) is actually a process in which chemical formulations (coatings, inks and adhesives) are converted from liquid to solid by means of energy irradiation sources (ultraviolet rays or electron beams). Compared with traditional curing technology, radiation curing technology has the advantages of environmental protection, energy saving, f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J163/10C09J133/08
Inventor 陈云传侯一斌陆企亭
Owner 康达新材料(集团)股份有限公司