Working platform lifting mechanism of full-automatic COG (Chip on Glass) binding machine

A technology of working platform and lifting mechanism, which is applied in the direction of nonlinear optics, instruments, optics, etc., can solve the problems of poor stability of the working platform and low equipment bonding accuracy, and achieve the problems of poor stability, improved bonding accuracy, and stable lifting Effect

Inactive Publication Date: 2011-06-08
DALIAN YISHENGDA INTELLIGENT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention aims to solve the problems of poor stability of the working platform and low precision of equipment bonding in the COG bonding machine, and provides a fully automatic COG bonding machine working platform lifting mechanism

Method used

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  • Working platform lifting mechanism of full-automatic COG (Chip on Glass) binding machine
  • Working platform lifting mechanism of full-automatic COG (Chip on Glass) binding machine
  • Working platform lifting mechanism of full-automatic COG (Chip on Glass) binding machine

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Embodiment Construction

[0011] The COG bonding machine is mainly to directly press the chip onto the glass. Among them, the working platform is the key part of the COG bonding machine. The platform needs to be lifted frequently during work. To ensure the stability of the platform and the smooth upgrade, the ordinary lifting mechanism cannot adapt high precision requirements.

[0012] Such as Figure 1-3 As shown, the lifting mechanism of the working platform of the fully automatic COG bonding machine of the present invention includes a platform 7, and four guide shafts 2 and four bearings 3 are installed at the four corners of the platform. Below the platform 7, a translation plate 6 is installed next to the bearings. A precision lead screw 9 is installed at the middle position of the upper right end of the translation plate 6, and four corners of the translation plate 6 are also installed to match the four bearings on the platform 7. The wedge-shaped fast 4, the translation plate 6 drives the wedge...

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PUM

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Abstract

The invention discloses a working platform lifting mechanism of a full-automatic COG (Chip on Glass) binding machine, comprising a platform, a translation board and a bottom board, wherein the right side of the bottom board is provided with a servo motor, and the four corners of the bottom board are respectively provided with a guide rail; the platform is provided with four guide shafts and four bearings; the translation board is provided with a lead screw and four wedge blocks; the translation board is fixed on the four guide rails of the bottom board; the servo motor drives the translation board to move left and right through lead screw rotation; the wedge blocks on the translation board push the bearings fixed on the platform to move up and down; due to the right-and-left guide of the four guide rails and the up-and-down guide of the four guide shafts and guide shaft sleeves, the lifting is steady; and because the platform is supported by four points, the platform is firm and stable, and the problem of poor stability of the working platform is solved and the binding precision of equipment is improved.

Description

technical field [0001] The invention relates to a mechanism in a fully automatic COG bonding machine, in particular to a working platform lifting mechanism. Background technique [0002] With the development of society, the COG installation method is more and more widely used, and the use of COG bonding machines is also increasing. Domestically, there are semi-automatic COG bonding machines produced by Shenzhen "Jiyin" company, and there are Panasonic and Hitachi abroad. Various bonding machines produced by other companies. The working platform such as the semi-automatic COG bonding machine produced by the "Jiyin" company only uses two ordinary guide rails to control the up and down movement, the stability of the platform is not good, and it cannot meet the needs of high precision. The accuracy is low. Contents of the invention [0003] The invention aims to solve the problems of poor stability of the working platform and low equipment bonding precision in the COG bondin...

Claims

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Application Information

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IPC IPC(8): G02F1/13
Inventor 李忠奎邹艳秋
Owner DALIAN YISHENGDA INTELLIGENT TECH
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