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Chip with version number and method for modifying version number of chip

A version number and chip technology, applied in the field of modification of the chip version number, can solve the problems of not being among them, increasing fab costs, etc., and achieve the effect of saving costs

Inactive Publication Date: 2011-06-22
ACTIONS SEMICONDUCTOR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the metal layer or via layer involved in modifying the chip version number may not be among them
In this way, in order to modify the chip version number, it is necessary to modify one or more layers of metal or via, which greatly increases the fab cost

Method used

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  • Chip with version number and method for modifying version number of chip
  • Chip with version number and method for modifying version number of chip
  • Chip with version number and method for modifying version number of chip

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Embodiment Construction

[0061] In the following description, many technical details are proposed in order to enable readers to better understand the application. However, those skilled in the art can understand that without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

[0062] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the implementation of the present invention in detail in conjunction with the accompanying drawings.

[0063] The first embodiment of the present invention relates to a chip with a version number and a method for modifying the version number of the chip.

[0064] First, the structure of the chip will be described.

[0065] The chip includes N metal layers stacked in sequence, there is a via layer between every two adjacent metal layers, and a devi...

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PUM

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Abstract

The invention relates to the field of chip design, and discloses a chip with a version number and a method for modifying the version number of the chip. In the invention, the inside of the chip is provided wit a pair of mutually-independent channels which pass through the inside of the chip from the bottom to the top and are respectively connected with high and low levels; and through selecting one of the two channels as a bit of the version number, the modification on the version number of the chip no longer depends on a specific layer, and can be implemented on any metal layer. Each through-hole layer is provided with a cross structure, therefore, the modification on the version number of the chip can be implemented only by modifying any through-hole layer.

Description

technical field [0001] The invention relates to the field of chip design, in particular to the modification technology of the chip version number. Background technique [0002] A chip version number (chip version) is used to identify a version of an integrated circuit (Integrated Circuit, "IC" for short) chip. [0003] In IC design, chip version is usually represented by several binary numbers. Taking 4 bits as an example, version 1 is identified as 4'b0000, version 2 is identified as 4'b0001, version 3 is identified as 4'b0010... and so on, version 15 is identified as 4'b1111. In the present invention, 4'b0000 is a mark indicating that all 4 bits are 0, and other similar marks have similar meanings. [0004] When the IC is revised, the chip version information will change, and the corresponding bits need to be modified. For example, from version 1 (4'b0000) to version 2 (4'b0001), the lowest bit needs to be modified; from version 2 (4'b0001) to version 3 (4'b0010), the l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50H01L23/522H01L21/768
CPCH01L23/544H01L2223/5444H01L2223/54473H01L2223/54433H01L2924/0002
Inventor 桂阳齐亚军
Owner ACTIONS SEMICONDUCTOR