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Surface-mounted type encapsulation structure of step-down piezoelectric ceramic transformer

A piezoelectric ceramic, packaging structure technology, applied in piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc., can solve the problems of affecting reliability, low integration density, easy to shake, etc., to improve the device Density, anti-shake effect

Inactive Publication Date: 2011-06-29
北京为华新光电子有限公司
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Problems solved by technology

[0006] In order to solve the problems of easy shaking, affecting reliability and low integration density in the prior art, the present invention provides a surface-mounted packaging structure of a step-down piezoelectric ceramic transformer, which ensures the vibration and good stability of the piezoelectric transformer during operation. Under the premise of heat dissipation, the piezoelectric transformer is fixed on the external circuit board by welding

Method used

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  • Surface-mounted type encapsulation structure of step-down piezoelectric ceramic transformer
  • Surface-mounted type encapsulation structure of step-down piezoelectric ceramic transformer
  • Surface-mounted type encapsulation structure of step-down piezoelectric ceramic transformer

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Embodiment Construction

[0024] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0025] Such as figure 1 Shown is a schematic cross-sectional view of the surface-mount packaging structure of the step-down piezoelectric ceramic transformer of the present invention; figure 2 It is a schematic front view of the surface mount package structure of the step-down piezoelectric ceramic transformer of the present invention; image 3 It is a schematic top view of the surface mount package structure of the step-down piezoelectric ceramic transformer of the present invention; Figure 4 It is a schematic cross-sectional top view of the surface mount package structure of the step-down piezoelectric ceramic transformer of the present invention.

[0026] Such as Figure 1-4 As shown, the surface mount packaging structure of the step-down piezoelectric ceramic transformer of the present invention includes: a st...

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Abstract

The invention discloses a surface-mounted type encapsulation structure of a step-down piezoelectric ceramic transformer. The structure comprises a step-down piezoelectric ceramic transformer, an external circuit board and an insulation gasket, wherein the step-down piezoelectric ceramic transformer is welded on welding spots on the external circuit board and connected with the external circuit board through the insulation gasket. Therefore, the surface-mounted type encapsulation structure of the step-down piezoelectric ceramic transformer can avoid the wobbling of the transformer which possibly occurs during use, meanwhile, surface-mounted type connection of the transformer is realized and device density of the external circuit is improved.

Description

technical field [0001] The invention relates to a packaging process of power electronic basic components, in particular to a surface-mounted packaging structure of a step-down piezoelectric ceramic transformer. Background technique [0002] Piezoelectric ceramic transformers are emerging power electronic components, which have the characteristics of low EMI, good EMC characteristics, high efficiency, high power density, light weight and short size. The current piezoelectric transformer products are mainly low-power (less than 10W) ​​step-up piezoelectric transformers (mainly used for LCD backlight power supply) and slightly larger power (less than 50W) step-down piezoelectric transformers (mainly used in various power sources). [0003] Piezoelectric ceramic transformers transmit energy through ultrasonic vibration (different from traditional electromagnetic transformers that transmit energy through electromagnetic conversion), so the vibration of the device cannot be hinde...

Claims

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Application Information

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IPC IPC(8): H01L41/107H01L41/053
Inventor 都金龙周伟革武彬
Owner 北京为华新光电子有限公司
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