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Component mounting device

A technology for installing devices and components, applied in the direction of electrical components, electrical components, etc., can solve problems such as equipment shutdown, processing cannot continue, and installation cannot be achieved, and achieve the effect of improving reliability

Active Publication Date: 2014-03-12
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned Patent Document 1, since the selectable mounting modes all need to be transported in some form in coordination with each other's channels and substrate transport time, one channel or one mounting head in two channels and two mounting heads If the head fails and the processing of one of the two channels stops, the processing of the other channel cannot continue.
Therefore, no matter in the case of selecting any installation mode in the synchronous mode (synchronous transfer independent installation mode) and asynchronous mode (asynchronous transfer alternate channel installation mode), because when two channels and one of the two installation heads transport When one path or one mounting head fails, installation on the other side of the conveying path cannot be performed, so it is prone to problems such as downtime of the entire equipment and loss of reliability
Of course, if each channel is operated independently in any case, degraded operation can be performed to improve reliability, but in this case, production efficiency will decrease and production cost will increase.

Method used

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no. 1 approach

[0030] refer to figure 1 and figure 2 , the configuration of the surface mounting machine 100 according to the first embodiment of the present invention will be described. The surface mounter 100 is an example of the "component mounting device" of the present invention.

[0031] Such as figure 1 As shown, the surface mounter 100 according to the first embodiment includes a board transfer conveyor 1 , a first head unit 2 , and a second head unit 3 . In addition, a plurality of tape feeders 4 for supplying electronic components are arranged in the X direction adjacent to the board transfer conveyor 1 on the front side (Y2 direction side) and rear side (Y1 direction side) of the board transfer conveyor 1 . In addition, a tray component supply device 5 and a tray storage unit 6 for storing a plurality of trays (not shown) are provided on the rear side of the substrate transfer conveyor 1 (on the side of the second conveyance path 12 ). In addition, a discard station 7 is prov...

no. 2 approach

[0085] Next, a second embodiment will be described. The second embodiment is different from the above-mentioned first embodiment in that the surface mounter 100 determines one mounting mode from the asynchronous transfer independent mounting mode and the asynchronous transfer alternate lane mounting mode in the mounting mode determination process.

[0086] In the mounting mode determination process of the surface mounter 100 according to the second embodiment of the present invention, the main control unit 102 Figure 8 As shown, step S48 and step S49 of the installation mode determination process related to the first embodiment are not performed (see Figure 5 ) corresponding actions. That is, in the second embodiment, when the planned number of sheets to be produced by the main control unit 102 on the side of the first conveying path 11 and the side of the second conveying path 12 is the same, regardless of the time required for mounting the two conveying paths 11 and 12, ...

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Abstract

The invention provides a component mounting device. The component mounting device (100) comprises: a first conveying path (11); a second conveying path (12); a first head part assembly (2) disposed at a side of the first conveying path (11) and capable of mounting electronic components on a first substrate (110) on the first conveying path (11) and a second substrate (120) on the second conveying path (12); a second head part assembly (3) disposed at a side of the second conveying path (12) and capable of mounting electronic components on the first substrate (110) on the first conveying path (11) and the second substrate (120) on the second conveying path (12); and a mounting mode selection part (102) selecting a proper mounting mode from a non-synchronous conveying independent mounting mode and a non-independent mounting mode based on substrate information, time information and device information. Therefore, reduction of production efficiency can be inhibited and higher reliability can be realized.

Description

technical field [0001] The present invention relates to a component mounting device, and more particularly to a component mounting device including a plurality of conveyance paths and a plurality of heads. Background technique [0002] Conventionally, a component mounting device including a plurality of conveyance paths and a plurality of heads is known (for example, refer to Japanese Patent Application Laid-Open No. 2009-224764, hereinafter referred to as Patent Document 1). [0003] In the above-mentioned Patent Document 1, it is disclosed that the front side passage (first conveyance path) provided on the front side, the rear side passage (second conveyance path) provided on the rear side, and the front side mounting head (second conveyance path) provided on the front side are disclosed. One head) and the rear side mounting head (second head) installed on the rear side of the component mounting machine. This component mounter selects the mode (mounting mode) with higher ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 藤章至小峰正道
Owner YAMAHA MOTOR CO LTD