Method for gluing LED module
An LED module and sealing technology, which is applied to electrical components, electric solid devices, circuits, etc., can solve the problems of LED modules that are not suitable for high integration, the cost of LED integrated modules is increased, and the packaging colloid is expensive. , to avoid integration restrictions, promote integration, and save packaging colloids
Inactive Publication Date: 2011-08-03
SHENZHEN GENTA LED COMPONENTS
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Problems solved by technology
[0005] Since the above glue filling method is used to seal the LED integrated module, it requires a large amount of encapsulation colloid to complete this process, and the encapsulation colloid is generally expensive, and the encapsulation colloid covering the circuit board causes waste, resulting in the entire The cost of LED integrated modules is greatly increased; in addition, the above method of glue filling is generally only applicable to circuit boards with PIN pins, and the spacing requirements of PIN pins directly limit the further integration of LED modules, so the method of LED glue filling Obviously not suitable for highly integrated LED modules
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[0015] like Figure 1 to Figure 4 As shown, the embodiment of the present invention provides an LED integrated module, which mainly includes a circuit board 1 provided with several LED light-emitting chips (the LED light-emitting chips are not shown in the figure), and a cover is arranged on one side of the circuit board 1 And be provided with the plastic mask 3 of several lamp cups 2 and the pressure plate 4 that is arranged on the other side of the circuit board 1, the pressure plate 4 is provided with a plurality of plastic container chambers 5 for accommodating the encapsulant, and the bottom surface of the plastic container chamber 5 corresponds to 4 Each pixel is provided with the first glue inlet hole 6 and the corresponding first exhaust hole 7 for guiding the encapsulant to enter the lamp cup 2 through the circuit board 1; the circuit board 1 is provided with a corresponding first glue inlet hole 6 The second glue inlet hole 8, and the second exhaust hole 9 correspond...
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The embodiment of the invention relates to a method for gluing a light emitting diode (LED) module. By the method, a preset fixed amount of encapsulation colloid is injected into a glue accommodating cavity on a pressing plate in a glue dispensing manner so that the encapsulation colloid passes through a first glue inlet hole on the pressing plate and a second glue inlet hole on a circuit board and enters a lamp cup of a cover board, and a first exhaust hole on the pressing plate and a second exhaust hole on the circuit board are used for finishing an auxiliary exhaust function. By adopting the embodiment of the invention, the amount of the encapsulation colloid required by gluing of the LED module can be controlled so that the gluing of the LED module can be finished; therefore, the waste of the encapsulation colloid on the LED module is avoided and the encapsulation colloid for gluing is saved greatly, so the cost of the LED module is reduced greatly.
Description
technical field [0001] The invention relates to the field of LEDs, in particular to a glue sealing method for LED modules. Background technique [0002] Light Emitting Diode (LED) module is a product composed of LEDs arranged together according to certain rules and packaged together, plus some waterproof treatment. LED modules are widely used in LED products, and there are great differences in structure and electronics. LED modules generally include circuit boards and housings equipped with LED light-emitting chips. [0003] As a kind of LED module, LED integrated module is mainly used in various information display boards, display screens, etc. Its most basic feature is to integrate several LED light-emitting chips on a circuit board of a certain specification. After a series of processes such as solid crystal, wire bonding, testing, sealing and curing, it is packaged into an LED module that meets the unified electrical requirements. It is generally composed of a circuit b...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L33/00H01L33/48H01L33/52H01L25/075
Inventor 黄少忠
Owner SHENZHEN GENTA LED COMPONENTS