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Method for manufacturing an electronic device housing

A technology of electronic equipment and casing, applied in the field of casing formed by materials

Active Publication Date: 2015-09-09
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using CNC machining applications to process CFRP to form protruding features may not be ideal given CFRP's tendency to crack or bend under shear stress

Method used

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  • Method for manufacturing an electronic device housing
  • Method for manufacturing an electronic device housing
  • Method for manufacturing an electronic device housing

Examples

Experimental program
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Embodiment Construction

[0024] Generally, the embodiments described herein take the form of housings for electronic devices and methods of making the same. The shell may be made of a layered, fiber-in-matrix type of material such as CFRP. In example embodiments, the housing may include at least one CFRP plate. On the surface of the housing, the plate may comprise one or more positioning features. These features may be configured to receive one or more blanks, which may be attached to attachment surfaces defined by the respective apertures. The attached blank may be processed to form a finished raised feature, as generally described below.

[0025] As shown in FIG. 1 , housing 105 may be the housing of laptop computer 101 in one embodiment. Housing 105 may be configured to house the electrical and mechanical components of laptop computer 101, including, but not limited to, the keyboard, wires, logic board, central processing unit (CPU), various chips, and / or fans, and the components necessary to op...

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PUM

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Abstract

A method for manufacturing an enclosure for an electronic device including forming the enclosure, forming one or more locating cavities on a surface of the enclosure, attaching one or more blanks to the enclosure using the one or more locating cavities, and processing the one or more attached blanks to form a desired shape thereof. The enclosure may be formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used.

Description

technical field [0001] Embodiments disclosed herein relate generally to housings for electronic devices, and more particularly, to methods of making housings formed from fiber-in-matrix materials. Background technique [0002] Many electronic devices, including portable electronic devices, have housings made of materials with fibers in a matrix. For example, some devices may have housings formed from carbon fiber reinforced plastic (CFRP). A standard CFRP can be constructed of multiple layers, each typically having carbon fibers aligned in a plastic matrix such that the fibers in that layer all extend in substantially the same direction. Carbon fibers impart structural strength and resistance to bending and breaking against forces applied perpendicular to the length of the fibers. As such, CFRP materials typically have high strength-to-weight and weight-to-stiffness ratios, but are prone to cracking or bending under shear stress, which can occur, for example, when CFRP she...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00B29C45/00G12B9/02B32B1/00
CPCB29L2031/3475B29C45/0025G06F1/1613B29C45/0055
Inventor K·M·肯尼
Owner APPLE INC