Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate processing device

A substrate processing device and substrate technology, which are applied to the original parts for photomechanical processing, devices for coating liquid on the surface, optics, etc., can solve the problems of difficulty in reaching the post-processing process and the number of substrates processed, and improve the The effect of processing the number of sheets, improving processing performance, and preventing growth

Inactive Publication Date: 2013-08-21
DAINIPPON SCREEN MTG CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, in the device structure as described above, the following problem will arise: when only a predetermined process is selected from a plurality of sequentially arranged processes, it is difficult to reach the post-processing process without passing through unnecessary processing process parts.
Therefore, the overall number of substrates processed may decrease

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing device
  • Substrate processing device
  • Substrate processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0029] figure 1 It is a figure which shows the substrate processing system provided with the substrate processing apparatus 100 of this invention.

[0030] In addition, in figure 1 In the figure, for the convenience of illustration and description, the Z-axis direction is defined as the vertical direction, and the XY plane is defined as the horizontal plane, but these are defined for the convenience of grasping the positional relationship, and are not limited to the directions described below. The same applies to the following figures.

[0031] In the substrate processing system, a square glass substrate used for manufacturing a screen panel of a liquid crystal display device is used as a substrate 90 to be processed.

[0032] The substrate processing system includes: a loading unit 81 for loading a substrate 90 to be processed; a cleaning unit ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

PURPOSE: A substrate processing apparatus is provided to increase the number of a substrate to be processed by spraying a process solution through only a first slit nozzle. CONSTITUTION: In a substrate processing apparatus, a transfer unit(2,3) is accessible to a coating unit and a drying unit(4). A substrate passing through a coating process is loaded in the drying unit, and then the substrates passing through a drying process is loaded in the coating unit again. Racks are installed to load the substrate from the drying unit. A mechanism returns the substrate passing through a heating process to the racks.

Description

technical field [0001] The present invention relates to a technique of forming a plurality of thin film layers in a substrate processing apparatus having a slit nozzle. Background technique [0002] Conventionally, there have been proposed substrate processing apparatuses that discharge a processing liquid from a slit nozzle to form a thin film on the surface of a substrate. For example, Patent Document 1 describes a substrate processing apparatus that ejects a processing liquid onto a substrate from a slit nozzle. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2007-287914 [0004] In general, when forming a thin film on a substrate using a slit nozzle, the substrate coated with the treatment liquid is dried under reduced pressure and heat-treated (heating and cooling) to form the thin film. Therefore, when a plurality of thin film layers are to be formed, the cycle of coating→drying→heat treatment will be repeated a predetermined number of times, and the length...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B05C9/06B05C9/14B05C13/02B05D1/38H01L21/00
CPCG03F1/60G03F7/16G03F7/2041H01L21/0274
Inventor 福原文人
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com