Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate processing device

A substrate processing device and a technology for substrates, which are applied to the original parts for opto-mechanical processing, devices for coating liquid on the surface, optics, etc. The effect of processing the number of sheets, improving the processing performance, and preventing growth

Inactive Publication Date: 2011-08-31
DAINIPPON SCREEN MTG CO LTD
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, in the device structure as described above, the following problem will arise: when only a predetermined process is selected from a plurality of sequentially arranged processes, it is difficult to reach the post-processing process without passing through unnecessary processing process parts.
Therefore, the overall number of substrates processed may decrease

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing device
  • Substrate processing device
  • Substrate processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0029] figure 1 It is a figure which shows the substrate processing system provided with the substrate processing apparatus 100 of this invention.

[0030] In addition, in figure 1 In the figure, for the convenience of illustration and description, the Z-axis direction is defined as the vertical direction, and the XY plane is defined as the horizontal plane, but these are defined for the convenience of grasping the positional relationship, and are not limited to the directions described below. The same applies to the following figures.

[0031] In the substrate processing system, a rectangular glass substrate used for manufacturing a screen panel of a liquid crystal display device is used as a substrate 90 to be processed.

[0032] The substrate processing system includes: a loading unit 81 for loading a substrate 90 to be processed; a cleaning ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a substrate processing device, which shortens device length and inhibits the declining of processing amount. When a plurality of coating liquid layers are disposed on the substrate, a plurality of coating devices and drying devices are disposed in a serial connection based on the laminating amount of the target layer, thereby the length of the device will be increased. The substrate processing device is provided with a moving unit in a manner of being able to access to the coating part and the drying part and moves the substrate completing the coating process to the drying part. The substrate after completing the regulated drying process is removed to the coating part for coating, thereby the length of the device can be prevented from increasing. A standby part is disposed at the drying part in a manner of lamination, and a mechanism enabling the substrate completing the heating process at the downstream to return to the standby part, thereby the processing efficiency of the substrate is further improved.

Description

technical field [0001] The present invention relates to a technique of forming a plurality of thin film layers in a substrate processing apparatus having a slit nozzle. Background technique [0002] Conventionally, there have been proposed substrate processing apparatuses that discharge a processing liquid from a slit nozzle to form a thin film on the surface of a substrate. For example, Patent Document 1 describes a substrate processing apparatus that ejects a processing liquid onto a substrate from a slit nozzle. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2007-287914 [0004] In general, when forming a thin film on a substrate using a slit nozzle, the substrate coated with the treatment liquid is dried under reduced pressure and heat-treated (heating and cooling) to form the thin film. Therefore, when a plurality of thin film layers are to be formed, the cycle of coating→drying→heat treatment will be repeated a predetermined number of times, and the length...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B05C9/06B05C9/14B05C13/02B05D1/38H01L21/00
CPCG03F1/60G03F7/16G03F7/2041H01L21/0274
Inventor 福原文人
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products