Unlock instant, AI-driven research and patent intelligence for your innovation.

Ultrasound transducer, ultrasound probe, and method for manufacturing ultrasound transducers

A technology of ultrasound and transducers, which is applied in the field of manufacturing ultrasonic transducers, ultrasonic probes and ultrasonic transducers, and can solve problems such as large quantities

Active Publication Date: 2014-02-12
TOSHIBA MEDICAL SYST CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this large number

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasound transducer, ultrasound probe, and method for manufacturing ultrasound transducers
  • Ultrasound transducer, ultrasound probe, and method for manufacturing ultrasound transducers
  • Ultrasound transducer, ultrasound probe, and method for manufacturing ultrasound transducers

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0035] (Schematic configuration of an ultrasonic transducer)

[0036] refer to Figure 1 to Figure 5 The outline of the ultrasonic transducer 100 of the first embodiment will be described. figure 1 It is a schematic perspective view showing the ultrasonic transducer 100 . in addition, figure 2 It is a schematic exploded perspective view showing the ultrasonic transducer 100 . image 3 It is a schematic cross-sectional view showing the connection state between the ultrasonic vibrator 110 a and the wiring board 130 a via the flexible substrate 120 in the ultrasonic transducer 100 . Hereinafter, a schematic configuration of the ultrasonic transducer 100 according to the present embodiment will be described. In addition, the number of arrays of ultrasonic vibrators 110 a and the number of wiring boards 130 a of ultrasonic transducer 100 shown in each figure are numbers shown conceptually. In addition, the shape formed with respect to the whole arrangement of the ultrasonic t...

no. 2 Embodiment approach

[0120] Next, refer to the ultrasonic transducer 200 related to the second embodiment and the ultrasonic probe 600 provided with the ultrasonic transducer 200. Figure 7 to Figure 11 Be explained. Figure 7 It is a schematic perspective view showing the ultrasonic transducer 200 . Figure 8 It is a schematic exploded perspective view showing the ultrasonic transducer 200 . Figure 9 It is a schematic cross-sectional view showing the connection state between the ultrasonic vibrator 210 a and the wiring board 230 a via the flexible substrate 220 in the ultrasonic transducer 200 . Figure 10 It is a schematic perspective view showing the wiring board block 230 of the ultrasonic transducer 200 . Figure 11 It is a schematic perspective view showing the wiring board 230 a of the ultrasonic transducer 200 . In addition, the second embodiment will mainly describe the parts different from the first embodiment. In the second embodiment, descriptions of portions overlapping with the ...

no. 3 Embodiment approach

[0141] Next, refer to the ultrasonic transducer 300 related to the third embodiment and the ultrasonic probe 600 provided with the ultrasonic transducer 300. Figure 12 to Figure 15 Be explained. Figure 12 It is a schematic perspective view showing the ultrasonic transducer 300 . Figure 13 It is a schematic disassembled perspective view showing the ultrasonic transducer 300 . Figure 14 It is a schematic perspective view showing the wiring board block 330 of the ultrasonic transducer 300 . Figure 15 It is a schematic perspective view showing the wiring board 330 a of the ultrasonic transducer 300 . In addition, in the third embodiment, differences from the first embodiment and the second embodiment will be mainly described. In the third embodiment, descriptions of portions overlapping with those of the first embodiment or the second embodiment may be omitted.

[0142] (outline of overall configuration)

[0143] like Figure 12 as well as Figure 13 As shown, the ultr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An ultrasound transducer according to an embodiment has two-dimensionally arranged ultrasound vibrators. A wiring board block is a laminate of wiring boards which are arranged along the row direction in the arrangement. The wiring board has a first surface facing a rear surface of the ultrasound vibrators and a second surface on its opposite side. First connection parts are provided on the first surface corresponding to the arrangement, and are conducted with back electrodes of the vibrators. Second connection parts are provided on the second surface, and are provided corresponding to the first connection parts. Connecting leads establish conductivity between the first and second connection parts through a fourth surface which is perpendicular to the second and third surfaces. Electronic circuits are connected to the second surface of the wiring board block, and are conducted with the second connection parts.

Description

[0001] (Cross-reference to related application) [0002] This application is based on and claims priority from prior Japanese Patent Application No. 2010-92542 filed on April 13, 2010, the entire contents of which are hereby incorporated by reference. technical field [0003] The present embodiment relates to an ultrasonic probe, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer. Background technique [0004] An ultrasonic probe is used for image generation by an ultrasonic imaging device. In recent years, ultrasonic transducers in a two-dimensional array (2D array) are used in ultrasonic probes. In a two-dimensional array ultrasonic transducer, the number of piezoelectric elements becomes large. Therefore, wiring of a lead (connecting lead: connecting lead) for connecting the element and the electronic circuit (delay circuit, etc.) becomes a problem. That is, when the number of leads (for example, 4096) connected to the two-dimensionally a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B06B1/06A61B8/00H04R1/06H04R17/00H10N30/40H10N30/87
CPCA61B8/4483A61B8/4405B06B1/0629G10K11/004Y10T29/42G01K11/04
Inventor 手塚智牧田裕久大贯裕
Owner TOSHIBA MEDICAL SYST CORP