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Cabinet recovery processing method and apparatus

A recovery processing and machine technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of prone to errors, scrapped wafers, and low efficiency of information exchange, avoiding erroneous operations and improving efficiency.

Active Publication Date: 2013-07-31
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0009] It can be seen that in the method of machine recovery processing provided by the prior art, information exchange is performed manually among MA, EE, and PE, and the efficiency of information exchange is relatively low, and errors are prone to occur. In addition, the method provided by the prior art The method of machine recovery processing must also rely on MA to manually operate the machine. If the MA is operated incorrectly, the wafer may be scrapped. Based on these reasons, the efficiency of machine recovery processing in the prior art is relatively low.

Method used

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  • Cabinet recovery processing method and apparatus

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Embodiment Construction

[0045] In order to make the object, technical solution and advantages of the present invention clearer, the solutions of the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0046] figure 1 It is a flow chart of the machine recovery processing method provided by the present invention. Such as figure 1 As shown, the method includes the following steps:

[0047] Step 101, pre-establish a general process flow, wherein the process parameters of the general process flow are empty.

[0048] To establish a general process flow, the method for establishing a process flow in the prior art may be used, and details are not repeated here.

[0049] However, the general process flow is different from the normal process flow in that the process parameters in the general process flow are empty, for example, parameters such as machine, prescription, and mask are all empty, while the normal process flow contains normal pr...

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Abstract

The invention discloses a cabinet recovery processing method. A general technological process is established in advance, wherein a technological parameter of the general technological process is empty. The method comprises the following steps: A. determining the technological parameter of a recovery processing flow; B. generating a recovery processing flow according to the technological parameters of the general technological process and the recovery processing flow; C. processing a wafer by the cabinet according to the recovery processing flow. Simultaneously, the invention also discloses a cabinet recovery processing apparatus. By using the method and the apparatus, efficiency of the cabinet recovery processing can be raised.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a method and device for machine recovery processing. Background technique [0002] In the manufacturing process of integrated circuits, under normal circumstances, the wafers on the machine are executed according to the pre-established normal work flow, which includes the pre-set normal process parameters. However, when the machine fails or When an alarm occurs, it is necessary to check the machine and the processed wafers on the machine, and then determine new process parameters according to the inspection results, and continue to process the unprocessed wafers. The above process is the process of machine recovery. [0003] In the prior art, the above-mentioned process is realized manually. Specifically, the method for machine recovery processing in the prior art includes the following steps: [0004] First of all, when the operator (MA) on the production line fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
Inventor 郭腾冲莫尤清董海龙高雪清王伦国隋云飞陈晓
Owner SEMICON MFG INT (SHANGHAI) CORP
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