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Device and method for at least partially encapsulating a closed flat carrier with electronic components

A technology for electronic components and packaging devices, applied in the field of devices that enclose flat carriers

Active Publication Date: 2015-04-22
BESI NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This causes considerable problems during the further processing of the carrier due to the relatively close distance between the connecting parts

Method used

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  • Device and method for at least partially encapsulating a closed flat carrier with electronic components
  • Device and method for at least partially encapsulating a closed flat carrier with electronic components
  • Device and method for at least partially encapsulating a closed flat carrier with electronic components

Examples

Experimental program
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Embodiment Construction

[0041] FIG. 1A schematically shows a cross-section of a device for encapsulating an electronic component carrier, generally referenced 1 . The device comprises a lower mold part 2a and an upper mold part 2b. The mold parts 2a and 2b are respectively recessed to form respective mold cavities 3a and 3b. The respective cavity 3 a and 3 b is closed on the carrier 4 when a carrier 4 is placed between the mold parts 2 a and 2 b. A chute 5 is provided leading into the cavity, which is used for feeding encapsulation material into the cavity 3 . The encapsulating material is pushed by a plunger 6 movable in the cylinder liner 10 . A vent channel 7 is connected to the side of the cavity 3 opposite to the sliding groove 5 . The two mold parts 2 a and 2 b can be separated from each other to place the carrier 4 to be encapsulated or to remove the encapsulated carrier 4 .

[0042] As shown in FIG. 1A , the device is dimensioned for encapsulation of both sides of a carrier 4 placed betwe...

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Abstract

The present invention relates to a device for encapsulating a closed flat carrier with electronic components, comprising a first mould part with a first mould cavity and a second mould part with a second mould cavity which is adapted to connect to the second side of the carrier. The invention also relates to a method for at least partially encapsulating a closed flat carrier with electronic components, and to a flat closed carrier with electronic components which is provided on two sides with encapsulating material.

Description

technical field [0001] The invention relates to a device for at least partially encapsulating a closed flat carrier with electronic components, comprising a first mold part having a first cavity, wherein the first cavity is used to connect a second part of the carrier. One side, and a layer of encapsulation material is arranged on the first side of the carrier. Background technique [0002] A carrier refers to a substantially flat component for carrying electronic circuits. Electronic components (especially integrated conductive connectors) can be placed on the carrier, or at least partly placed in the carrier. The carrier is usually made of an at least partially electrically insulating material, such as silicon or a ceramic material; but it is also possible to use a material with good electrical conductivity, such as copper, provided that the carrier must also be provided with at least one layer of insulating material to achieve different Electrical separation between cir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
CPCH01L2924/0002H01L21/565H01L2924/00H01L21/56
Inventor W·G·J·加尔H·A·M·费尔肯斯
Owner BESI NETHERLANDS BV