Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Plasma processing equipment

A technology of plasma and processing equipment, applied in the field of microelectronics, can solve the problems of limited space for tool use, limited maintenance space, inconvenient use of tools, etc.

Active Publication Date: 2011-11-16
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF1 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, due to the limited maintenance space in the housing 12, when the upper electrode part is partially opened, it is necessary to use a tool to unscrew the lock nut 182. During the operation, the tool is easy to hit the quartz window 14 and damage it; The use space of the tool is very limited, which makes the use of the tool more inconvenient, thus further prolonging the maintenance time of the equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plasma processing equipment
  • Plasma processing equipment
  • Plasma processing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The core of the present invention is to provide a plasma processing device, the electrode opening mechanism of which can improve the positioning accuracy of the upper electrode part when it is closed again, thus having higher working reliability.

[0037] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0038] Please refer to Figure 5 and Figure 6 , Figure 5 It is a perspective view of a specific embodiment of the electrode opening mechanism of the plasma processing equipment provided by the present invention; Figure 6 for Figure 5 The schematic cross-sectional view of the electrode opening mechanism shown when the upper electrode part is not opened.

[0039] In a specific embodiment, the plasma processing equipment provided by the present invention includes a chamber 0 a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses plasma processing equipment. An electrode opening mechanism of the processing equipment comprises a lifting component, wherein the outside part of the lifting component is installed on the inner wall of an electrode shell (22) of the plasma processing equipment and moves in the vertical direction driven by the electrode shell (22); the inside part of the lifting component is alternatively clamped with or separated from an adjusting bracket (23) of the plasma processing equipment in the vertical direction, thus the inclination of the adjusting bracket (23) caused in theprocess of reconnecting the lifting component and the adjusting bracket (23) can be avoided, the positioning reliability between a reaction cavity (0) and the lifted adjusting bracket (23) falling down again can be ensured, and then the positioning reliability of a top electrode closed again can be improved and the working performance of the plasma processing equipment can be improved.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a plasma processing equipment. Background technique [0002] With the rapid development of my country's economic construction, the market demand for various microelectronic components is increasing, which drives the rapid development of microelectronic technology. Plasma processing equipment is a typical microelectronic processing equipment, which is widely used in the field of microelectronic technology. [0003] Please refer to figure 1 , figure 1 It is a schematic structural diagram of a typical plasma processing equipment in the prior art. [0004] A typical plasma processing equipment includes a reaction chamber 11, the top of the reaction chamber 11 supports an adjustment support 13 for adjusting the height of its internal space, and the upper surface of the adjustment support 13 supports a quartz window for preventing plasma leakage 14. A metal coil that gener...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01J37/02
Inventor 张小昂
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com