Heat radiating device and airflow generator thereof

Abstract

The invention discloses a heat radiating device, comprising a heat radiator and an airflow generator. The airflow generator comprises a plurality of stacked airflow generation units. Each airflow generation unit comprises a box body, a first diaphragm, a second diaphragm, a first driving member, a second driving member and a nozzle. In each airflow generation unit, the first diaphragm and the second diaphragm are arranged in the box body at interval; a first chamber is formed between the first diaphragm and the second diaphragm; the nozzle is arranged at one side of the box body in a manner of corresponding to the first chamber, so that the first chamber is communicated with outside through the nozzle; the first driving member comprises a first moving magnet arranged on the first diaphragm and a first fixed magnet arranged on the box body; the second driving member comprises a second moving magnet arranged on the second diaphragm and a second fixed magnet arranged on the box body; and when the first diaphragm and the second diaphragm move oppositely under the actions of the first driving member and the second driving member, the first diaphragm and the second diaphragm compress gas in the first chamber to generate an airflow sprayed out through the nozzle.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device used in an electronic device to dissipate heat for electronic components and an airflow generator used therein. Background technique [0002] In electronic devices such as notebook computers, a heat dissipation device is often used to dissipate heat from electronic components such as a CPU inside it. The heat dissipation device includes a heat dissipation fan and a heat dissipation fin group, the heat dissipation fin group is arranged at the outlet of the heat dissipation fan and is thermally connected with the electronic component through a heat pipe. The heat generated by the electronic components is transmitted to the heat sink group by the heat pipe, and the cooling fan generates airflow and blows it to the heat sink group to take away the heat transferred to the heat sink group. [0003] However, when the cooling fan operates at a high speed, it is pron...

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Problems solved by technology

[0003] However, when the cooling fan is running at a higher speed, it is prone to noise and may cause unstable operation

In addition, in cooling fans, in order to achieve a certain air volume, the motor must have a corresponding size, which cannot meet the requirements of the development of electronic devices in the direction of thinning and thinning.

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