Method and apparatus for dressing polishing pad
A grinding device and dressing device technology, applied in the direction of grinding devices, abrasive surface adjustment devices, grinding machine tools, etc., can solve the problems of reduced work efficiency, shortened life of the grinding pad, unstable grinding speed, etc., to improve work efficiency and prolong life , the effect of reducing the number of times
Active Publication Date: 2015-04-01
FUJIKOSHI MACHINERY
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Problems solved by technology
However, the grinding rate is unstable
Therefore, it is necessary to adjust the grinding speed according to the grinding time, so it is difficult to precisely control the grinding operation of the grinding workpiece
In addition, after seven batches of grinding operations, it takes 15-20 minutes to install the dressing carrier instead of the workpiece carrier and dress the grinding pad, so the work efficiency must be reduced
In addition, the surface of the polishing pad is ground by the leveling stone every time seven batches of grinding operations are carried out, so the life of the polishing pad must be shortened
Method used
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Embodiment Construction
[0032] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0033] figure 1 It is a partial plan view of a double-sided grinding device 10 and a polishing pad conditioning device 12 related to the present invention, figure 2 It is a partial front view of the double-sided polishing device 10 and the polishing pad dressing device 12 .
[0034] The two-sided grinding device 10 includes: a lower grinding plate 14 having an upper surface to which a grinding pad (not shown) made of, for example, polyurethane is attached; an upper grinding plate 15 having a lower surface to which a grinding pad (not shown) is attached a sun gear 16 constituted by a pin gear; an internal gear (internal gear) 17 constituted by a pin gear;
[0035] Each carrier 18 has a through hole 19 in which a workpiece to be ground, for example a semiconductor wafer, is to be accommodated. By rotating the sun gear 16 and the ring gear 17 , ...
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The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of a work by pressing the work onto the polishing pad fixed on a polishing plate (14, 15) with supplying slurry thereto, by using a grind stone, comprising the step of cleaning the polishing pad by supplying high-pressure cleaning water to the polishing pad, is characterized by the step of dressing the polishing pad by moving a dressing grind stone (26), in the radial direction of the polishing pad, along a surface profile thereof, while performing the cleaning step.
Description
technical field [0001] The invention relates to a dressing method and a dressing device of a polishing pad. Background technique [0002] A workpiece such as a semiconductor wafer is ground by pressing the surface of the workpiece to be ground onto the surface of a polishing pad attached to the polishing plate, and rotating the grinding plate while supplying slurry to the polishing pad. [0003] After the polishing operation is completed, the polishing pad includes generated dust and polishing liquid, thereby reducing the polishing speed. Therefore, high-pressure water is sprayed on the polishing pad every time a batch of polishing operations is performed to clean the polishing pad (see Japanese Patent Application Laid-Open No. 7-9340). Even if the polishing pad is cleaned every time one batch of polishing operations is performed, the surface of the polishing pad is deformed in a wavy form with concavo-convex portions after approximately seven batches of polishing operation...
Claims
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IPC IPC(8): B24B53/017B24B53/12B24B37/04B24B53/007B24B53/02B24B53/095
CPCB24B53/017B24B37/08B24B33/00B24B37/00B24B37/04B24B53/007B24B53/02B24B53/095B24B53/12H01L21/304
Inventor 小山晴道
Owner FUJIKOSHI MACHINERY