An uncooled far-infrared thermal imaging system

A far-infrared and thermal imaging technology, applied in the field of infrared thermal imaging, can solve the problems of low-cost marketization obstacles, difficult cost control, and vacuum packaging difficulties, and achieve the effects of avoiding Johnson noise, reducing vacuum packaging costs, and reducing volume

Inactive Publication Date: 2011-12-21
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

Traditional focal plane array (FPA) signals are usually read out with silicon process integrated circuits, and these detector materials are usually not matched with silicon, and the circuits on each FPA make vacuum packaging difficult, resulting in uncontrollable cost and becoming Obstacles to low-cost marketization

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  • An uncooled far-infrared thermal imaging system
  • An uncooled far-infrared thermal imaging system
  • An uncooled far-infrared thermal imaging system

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Embodiment Construction

[0034] An uncooled far-infrared thermal imaging system, such as figure 1 As shown, it includes a chopper 1, a far-infrared light (LWIR) lens 2, a beam splitter 3, an infrared focal plane array (IRFPA) 4, a near-infrared light (NIR) light source 5, a near-infrared light lens 6, and a near-infrared light filter Device 7, near-infrared light lens 8 and digital camera 9. The far-infrared light emitted by the target visual field is sequentially sampled by the chopper 1 and collimated by the far-infrared lens 2, and then enters the infrared focal plane array 4 through the beam splitter 3; the near-infrared light emitted by the near-infrared light source 5 passes through the first After the near-infrared light lens 6 is collimated, it is filtered by the near-infrared light filter 7 to become a narrow-band near-infrared reference light, and the narrow-band near-infrared reference light is reflected by the beam splitter 3 into the infrared focal plane array 4; The infrared reference l...

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Abstract

The invention relates to an uncooled far infrared thermal imaging system, belonging to the technical field of infrared thermal imaging. The uncooled far infrared thermal imaging system comprises a chopper, a far infrared light lens, a light splitter, an infrared focal plane array, a near infrared light source, a near infrared light lens, a near infrared light filter, another near infrared light lens and a digital camera; and the core component is the infrared focal plane array, the array structure of the infrared focal plane array is a thin film filter in an F-P cavity structure and the material of the cavity is alpha polycrystalline silicon, and the two sides of the cavity are provided with multiple film layers which are alternately formed by alpha polycrystalline silicon thin films and Si3N4 thin films to form a mirror surface structure. In the invention, on the basis of thermo-optic effect principle of the F-P cavity thin film filter, a measuring method of integrated optics is adopted and converting, demodulating and imaging on the optical wave are carried out, so that an interior reading circuit is eliminated and Johnson noise is avoided; meanwhile, vanadium oxide or pyroelectricity material which is usually not matched with silicon can be avoided from being used, devices are highly integrated without influence on the performance thereof, volume is reduced, producing stepsand vacuum packaging cost are reduced, and cost can be greatly reduced; therefore, the uncooled far infrared thermal imaging system provided by the invention has certain application potential.

Description

technical field [0001] The invention belongs to the technical field of infrared thermal imaging and relates to an uncooled far-infrared thermal imaging system. Background technique [0002] Uncooled thermal imaging cameras are finding increasing applications in many fields such as security, surveillance, countermeasures, automotive and traffic control. Due to the shortcomings of cooling thermal imagers such as expensive detector materials, low yield, poor system reliability, bulky size, and high power consumption of the system, it greatly limits its promotion in low-cost weapon systems and industrial and commercial fields. The development and production of uncooled thermal imaging cameras with the advantages of low price, small size, low power consumption, reliable performance, and convenient operation has become inevitable, especially in recent years. [0003] Uncooled thermal imaging cameras all use staring focal plane arrays, which currently mainly include uncooled detec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/08G01J5/62
Inventor 刘爽曾璞魏广路马华平钟智勇刘永
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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