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Wafer coating machine and coating method

A gluing machine and gluing technology, applied in coatings, devices for coating liquid on the surface, etc., can solve the problems of high equipment cost, inconvenient operation, and damage to the stencil, and achieve uniform gluing, simple structure, The effect of easy disassembly

Inactive Publication Date: 2011-12-28
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD +1
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0002] At present, there are wafer coating problems in the semiconductor chip packaging process, especially problems such as uneven coating, low efficiency, and damage to the stencil.
In addition, the existing product structure is complicated, and it needs to be turned over when it is disassembled, cleaned, and replaced, which is extremely inconvenient to operate, low in efficiency, and high in equipment costs

Method used

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  • Wafer coating machine and coating method
  • Wafer coating machine and coating method
  • Wafer coating machine and coating method

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Embodiment Construction

[0016] In the following, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0017] refer to Figure 1-4 , the wafer coating machine according to a preferred embodiment of the present invention is mainly composed of a coating platform, a forward and backward movement mechanism, a coating mechanism and a detection device. In this embodiment, the gluing platform is mainly composed of legs 11, stand 5 and screen plate 6; the forward and backward movement mechanism is mainly composed of servo motor 4, control module 3, and guide rail 7; the gluing mechanism is mainly composed of first cylinder 1, The second cylinder 14, the first squeegee 12, and the second squeegee 17 are composed. In addition, the gluing mechanism also includes a spring 10, a guide shaft 13, a gluing device 2, and the like. The gluing mechanism is installed on the forward and backward movement mechanism via the support plate 9. Th...

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Abstract

The invention discloses a wafer gluing machine and a gluing method. The wafer gluing machine includes a gluing platform, a gluing mechanism, a forward and backward movement mechanism and a detection device, wherein the gluing mechanism includes a first cylinder and a second cylinder. 1. The first squeegee and the second squeegee are respectively driven by the first cylinder and the second cylinder. The gluing mechanism reciprocates back and forth under the drive of the forward and backward movement mechanism to perform the gluing operation. During the gluing process, When the gluing mechanism moves forward, the second cylinder lifts up, the second squeegee leaves the gluing platform correspondingly, and the first squeegee performs gluing operation; when the gluing mechanism moves backward, the first cylinder lifts , the first squeegee leaves the gluing platform correspondingly, and the second squeegee performs the gluing operation. According to the invention, not only can glue be applied uniformly with high efficiency, but also the structure is simple, the cleaning and disassembly are convenient, and the cost is low.

Description

technical field [0001] The invention relates to a wafer gluing machine and a gluing method, in particular to a wafer gluing machine and a gluing method capable of uniform gluing with high efficiency. Background technique [0002] At present, there are wafer coating problems in the semiconductor chip packaging process, especially problems such as uneven coating, low efficiency, and damage to the stencil. In addition, the existing product has a complex structure and needs to be turned over when it is disassembled, cleaned, and replaced, which is extremely inconvenient to operate, low in efficiency, and high in equipment costs. Contents of the invention [0003] In order to solve the above-mentioned problems in the prior art, according to one aspect of the present invention, a wafer glue coating machine is provided, including a glue coating platform, a glue coating mechanism, a forward and backward movement mechanism and a detection device, and the glue coating mechanism incl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C1/06B05C11/02B05C13/02B05D1/28
Inventor 刘劲松杨利宣李小平
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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