Card gluing mechanism

Abstract

The invention discloses a card gluing mechanism. The gluing mechanism comprises a base, a fixing base, a pushing air cylinder, a sliding base, a jacking and placing mechanism, a supporting frame, a first proximity switch, a second proximity switch, guide rods, a pressing frame, first springs, a glue uniformizing plate with a plurality of glue uniformizing holes and a gluing mechanism; and a raw material plate to be glued is placed in the jacking and placing mechanism, the pushing air cylinder pushes the sliding base to move rightwards in place, the jacking and placing mechanism drives the rawmaterial plate to move upwards to be in contact with the glue uniformizing plate, the first springs are compressed, the gluing mechanism penetrates through the pressing frame to be in contact with theglue uniformizing plate, then a glue solution coats the raw material plate due to the action of the surface tension, so that glue solution coating is completed. According to the card gluing mechanism, the structure is simple, gluing can be automatically carried out on the raw material plate, the jacking and placing mechanism can be used for carrying out positioning and fixing and exerting certainpressure on the raw material plate, so that gluing is uniform, the gluing process and the raw material plate ejection process are combined together, so that the action time is shortened, and the production efficiency is improved; and meanwhile, devices such as air cylinders do not need to be arranged, so that the production cost is effectively reduced.

Description

technical field [0001] The invention relates to a mechanical device, in particular to a card gluing mechanism. Background technique [0002] The existing electronic chip card is composed of a card body and a chip arranged on the card body, and a sensing coil connected with the chip to form a conduction is buried inside the card body, thereby forming an electronic chip card. At present, the card body is made by bonding multiple raw material boards. In the actual production of gluing, the raw material boards need to be placed in the mold with positioning grooves first, and then the glue is brushed with a rubber cylinder. After the glue is brushed, The cylinder inside the mold is enough to push out the raw material plate. Since the glue attached to the surface of the rubber cylinder is poor in uniformity, the uniformity of the glue coated on the raw material plate is also poor. In view of the above defects, it is necessary to design a card gluing mechanism. Contents of the i...

AI Technical Summary

Problems solved by technology

At present, the card body is made by bonding multiple raw material boards. In the actual production of gluing, it is necessary to place the raw material boards in the mold with positioning grooves first, and then use the rubber cylinder for glue brushing. After the glue brushing is completed, The cylinder inside the mold is enough to push out the raw material plate. Since the glue attached to the surface of the rubber cylinder is poor in uniformity, the uniformity of the glue coated on the raw material plate is also poor.

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