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chemical mechanical polishing method

A technology of chemical machinery and polishing pads, which is applied in the direction of grinding machine tools, grinding devices, metal processing equipment, etc., can solve the problems of short service life of polishing pads, achieve the effect of improving the effect, reducing the amount of water used, and prolonging the service life

Inactive Publication Date: 2011-12-28
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the existing chemical mechanical polishing method, there is a defect that the service life of the polishing pad is short

Method used

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Embodiment Construction

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0023] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or elem...

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Abstract

The invention discloses a chemical mechanical polishing method. The chemical mechanical polishing method comprises: A) clamping a wafer by a polishing head to perform chemical mechanical polishing on the wafer on a polishing pad; Spray water on the polishing pad during polishing stops to moisturize the polishing pad. The chemical mechanical polishing method according to the embodiment of the present invention can not only improve the effect of chemical mechanical polishing, but also greatly prolong the service life of the polishing pad.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to a chemical mechanical polishing method. Background technique [0002] In the manufacturing process of integrated circuits, as the feature size shrinks and the number of metal interconnection layers increases, the requirements for the flatness of the wafer surface are getting higher and higher. Currently, chemical mechanical polishing is the most effective global planarization technique. Chemical mechanical polishing is to hold the wafer by the rotating polishing head and press it on the rotating polishing pad with a certain pressure. The polishing liquid composed of abrasive grains and chemical solution flows between the wafer and the polishing pad. The surface is planarized by a combination of chemical and mechanical action. In the existing chemical mechanical polishing method, there is a defect that the service life of the polishing pad is short. Contents of the invention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04
Inventor 路新春王同庆
Owner TSINGHUA UNIV