Embedded-type circuit board and production method thereof
A manufacturing method and a circuit board technology, which are applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, etc., can solve problems such as circuit board warping, uneven force, and damage to electronic components. To achieve the effect of preventing warping, balanced structure and avoiding damage
Active Publication Date: 2013-06-26
深圳广芯封装基板有限公司
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Problems solved by technology
[0004] During the research and practice of the prior art, the inventors of the present invention found that in the existing embedded circuit board, the electronic components embedded in the groove opened by the core board are often located on one side of the circuit board. During the manufacturing process, for example, when pressing each insulating layer or metal layer or other layers, the circuit board is warped due to uneven force on both sides of the board, so that the electronic components embedded in it are damaged.
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[0051] In other embodiments, after the paired embedded laminates pasted with electronic components are synthesized into a substrate embedded with even-numbered layers of electronic components, the copper clad laminates that have formed circuit patterns, including single-sided copper clad laminates, can also be directly Or double-sided copper-clad laminate, which is pressed on the surface of the substrate. Of course, an insulating layer can be added between the substrate and the copper-clad laminate to separate the two. substrate surface. Then, blind holes corresponding to the embedded electronic components can be opened on the pressed copper clad board, so that the embedded electronic components can be electrically connected with the existing circuit pattern on the pressed copper clad board.
[0052] In summary, using the method of the embodiment of the present invention, even-numbered layers of electronic components are embedded in the embedded circuit board and arranged in p...
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The invention discloses a production method of an embedded-type circuit board, which comprises the following steps that: a groove body is arranged on paired embedded layers, an electronic element is adhered onto the groove body, a groove body on one embedded layer corresponding to the electronic element on the other embedded layer and the groove body and the electronic element on one embedded layer are arranged at intervals; and the paired embedded layers are laminated together, so the electronic element on one embedded layer is plugged into the corresponding groove body on the other embeddedlayer. The invention also provides the embedded-type circuit board. Even number layers of electronic elements are paired to be embedded inside the circuit board which is produced through the production method, and the paired two layers of electronic elements are arranged at intervals, so the structure is balanced and symmetric, the warp of the circuit board can be prevented, and the damage of theelectronic elements can be avoided.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to an embedded circuit board and a production method thereof. Background technique [0002] With the development of the information society, the amount of information processed by various electronic devices is increasing day by day, and the demand for high-frequency and high-speed signal transmission is also increasing. Embedding semiconductor electronic components into packaging substrates can effectively shorten the connection distance between electronic components and packaging substrates, provide a strong guarantee for high-frequency and high-speed signal transmission, and also meet the development needs of high integration of packages and miniaturization of electronic products. [0003] figure 1 It shows an existing embedded circuit board, including an outer metal layer 101 and an insulating layer 102, and an inner core board 103, on which a groove body 104 is...
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IPC IPC(8): H05K1/18H05K3/30
Inventor 霍如肖鲍平华谷新黄达利
Owner 深圳广芯封装基板有限公司