Silicon bar flushing frame

Abstract

The invention discloses a silicon bar flushing frame, relating to the field of cutting of monocrystal and polycrystal silicon bars, in particular to a flushing device. The silicon bar flushing frame comprises a bracket, wherein the upper end of each support leg is connected with an installation base respectively; a support plate is fixedly connected above the bracket; the middle part of the support plate is provided with an opening; the silicon bar flushing frame further comprises a water inlet pipe; the water outlet end of the water inlet pipe is connected with a three-way piece; the water outlet ends on the left and right sides of the three-way piece are connected with a first water pipe respectively; the other end of each first water pipe is connected with a second water pipe respectively though a corner joint; two second water pipes are arranged on both sides below the opening of the support plate respectively; the other end of each second water pipe is a blind end respectively; each second water pipe is inserted into a corresponding installation base respectively; and opposite surfaces of the two second water pipes are provided with a plurality of water outlet holes respectively. During flushing, both sides of a material plate are arranged on the support plate on both sides of the opening, and water flows out of the water outlet holes on the second water pipes for flushing oppositely, so that a silicon wafer can be detached from glass conveniently and rapidly.

Description

technical field [0001] The invention relates to the field of cutting single crystal and polycrystalline silicon rods, in particular to a flushing device. Background technique [0002] The multi-wire cutting machine is equipped with a lifting mechanism and two main rollers. The silicon rod workpiece is connected to the bottom of the lifting mechanism. The silicon rod workpiece includes a material plate, glass and silicon rod. The glass is glued to the bottom of the material plate, and the silicon rod is glued to the bottom of the material plate. Below the glass; grooves are spirally arranged on the outer circumference of each main roller, and the same steel wire is wound in the grooves of the two main rollers, and the steel wire is arranged under the silicon rod. When cutting silicon rods, the rotation of the two main rollers drives the steel wires to move back and forth, and the lifting mechanism drives the silicon rods to move downwards. Through the cooperation of steel wir...

AI Technical Summary

Problems solved by technology

When cutting silicon rods, the rotation of the two main rollers drives the steel wires to move back and forth, and the lifting mechanism drives the silicon rods to move downwards. Through the cooperation of steel wires and slurry, multi-wire cutting is realized into several silicon wafers. After cutting, each silicon wafer The upper end of the silicon chip is still stuck to the glass, and it needs to be manually washed with water to separate the silicon wafer from the glass, which is very inconvenient and easy to damage

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