A light detection arrangement and a method for detecting light in a light detection arrangement
A technology of light detection device and light device, which is applied in the field of light detection and can solve problems such as low contrast brightness adjustment range
Active Publication Date: 2014-05-07
AGENCY FOR SCI TECH & RES +1
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
These issues can include relatively low contrast between the chip and the lead connections, difficulty extracting object information for three-dimensional (3D) computing, and the limited brightness adjustment range of some lighting systems
Method used
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[0029] The following detailed description refers to the drawings, showing, by way of illustration, specific details and embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The various embodiments are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments.
[0030] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any implementation or design described herein as "exemplary" is not to be construed as preferred or advantageous over other implementations or designs.
[0031] One embodiment may provide a light detection device. The light detection device may include: a body structure configured ...
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In an embodiment, a light detection arrangement may be provided. The light detection arrangement may include a body structure configured to provide light, the body structure including a first light-transmissive portion and a second light-transmissive portion disposed at a distance from the first light-transmissive portion; an object receiving region arranged such that light provided by the body structure may be illuminating at least a portion of the object receiving region; a first camera having a first main optical axis; a second camera having a second main optical axis; wherein the body structure may be arranged between the first camera and the second camera on its one side and the object receiving region on its other side; wherein the first camera may be arranged such that its first main optical axis may be directed to the object receiving region via the first light-transmissive portion; wherein the second camera may be arranged such that its second main optical axis may be directed to the object receiving region via the second light-transmissive portion; an arrangement configured to provide light reflected from the object receiving region such that a first reflected light portion may be provided as a first co-axial light portion aligned to the first main optical axis, and such that a second reflected light portion may be provided as a second co-axial light portion aligned to the second main optical axis. A method for detecting light in a light detection arrangement may also be provided.
Description
technical field [0001] Embodiments relate to a light detection device and a method for detecting light in the light detection device. Background technique [0002] Semiconductor devices, such as integrated circuit chips, may be electronically connected to leads on a lead frame by a process known as wire bonding. The wire bonding process involves the use of wires to connect pads located on a chip or wafer to leads on a lead frame. Once the chip and leadframe have been wire bonded, the chip and leadframe may be further packaged in ceramic or plastic to form an integrated circuit device. [0003] In many cases, inspection of the quality of the lead splices can be performed manually by a human operator using a microscope. However, this manual method can be time consuming and expensive. Therefore, automated wire splice inspection is desired. However, for automated wire splice inspection, many challenges may need to be resolved. For example, due to the relatively high specula...
Claims
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IPC IPC(8): H01L21/66G01B11/24G01N21/956
CPCG01B11/245G02B27/143G02B5/02G01N21/8806G02B27/1006G02B27/144G01B11/24G02B27/141G02B27/14
Inventor 刘通林秋江方仲平徐健曹润富余家齐
Owner AGENCY FOR SCI TECH & RES