Low-density multilayer circuit board capable of integrating high-density multilayer board as well as manufacturing method thereof

Abstract

The invention provides a low-density multilayer circuit board capable of integrating a high-density multilayer board as well as a manufacturing method of the low-density multilayer circuit board. The manufacturing method comprises the following steps of forming an accommodating space in a low-density mother board in a penetrating manner so as to accommodate a high-density multilayer daughter board; carrying out board pressing on both an upper surface and a lower surface of the low-density mother board; combining the high-density multilayer daughter board in the low-density mother board; exposing the high-density multilayer daughter board and carrying out drilling, electroplating and circuiting steps on the high-density multilayer daughter board; and electrically connecting the low-density mother board and the high-density multilayer daughter board. In this way, a low-density multilayer board can be achieved through the final board pressing step, and the high-density multilayer daughter board can be integrated in the low-density multilayer board, so that related circuit designers can design circuit layouts of different characteristic circuits on a single circuit board; and more production and material cost can be saved compared with the traditional method of directly adopting a single high-density multilayer circuit board.

Description

technical field [0001] The invention relates to a multilayer circuit board and a manufacturing method thereof, in particular to a low-density multilayer circuit board integrating high-density multilayer boards and a manufacturing method thereof. Background technique [0002] Due to the miniaturization of current electronic devices, the density of electronic components must be increased to meet the demand for miniaturization; therefore, packaging or manufacturing methods for electronic components and printed circuit boards must be miniaturized and multi-layered. [0003] The printed circuit board was a single-sided or double-sided single-layer board in the early days, but now it has a multi-layer board structure, which can increase the circuit density. In addition to the increase in circuit density, it is necessary to design multilayer circuit boards with different circuit layers or materials in response to different circuit characteristics. In the case of printed circuit boa...

AI Technical Summary

Problems solved by technology

Therefore, at present, mobile phone manufacturers use high-density multi-layer printed circuit boards in order to improve the quality of sending and receiving signals, but naturally the production cost is relatively high.

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