Hybrid high/low density multi-layer circuit board and process thereof

Abstract

The invention relates to a hybrid high / low density multi-layer circuit board and a process thereof. The process is characterized in that an accommodating space is formed on a low density multi-layer motherboard and is used for accommodating a high density multi-layer daughter board; two compression boards are compressed on the two opposite surfaces of the low density multi-layer motherboard; the high density multi-layer daughter board is fixed in the low density multi-layer motherboard; and a plurality of conductive drill holes and lines are formed on the compression boards and are respectively connected with lines on the low density multi-layer motherboard and the high density multi-layer daughter board electrically. The hybrid high / low density multi-layer circuit board and the process have the following advantages: the high density multi-layer daughter board is embedded in the low density multi-layer motherboard; therefore the relevant circuit designers can design layouts of the circuits with different characteristics on a single circuit board, not only is the circuit layout elasticity higher, but also more manufacturing and material costs can be saved by adopting the hybrid high / low density multi-layer circuit board compared with the single high density multi-layer circuit board.

Description

technical field [0001] The invention relates to a multilayer circuit board and its technology, in particular to a mixed high and low density multilayer circuit board and its technology. Background technique [0002] Due to the miniaturization of current electronic devices, the density of electronic components must be increased to meet the demand for miniaturization; therefore, packaging or process miniaturization and multi-layer technology must be proposed for electronic components and printed circuit boards. [0003] The printed circuit board was a single-sided or double-sided single-layer board in the early days, but now it has a multi-layer board structure, which can increase the circuit density. In addition to the increase in circuit density, multi-layer circuit boards with different circuit characteristics, different circuit layers or materials must be used at present. In the case of printed circuit boards for mobile phones, the internal circuits contain high-frequency ...

AI Technical Summary

Problems solved by technology

[0004] It can be seen that the above-mentioned existing electronic devices tend to be miniaturized and obviously still have inconveniences and defects in structure and use, and need to be further improved urgently.

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