Chip-on-film packaging structure

Abstract

The invention provides a chip-on-film packaging structure. The chip-on-film packaging structure comprises a flexible film, at least two conductive members, an insulator, at least two first upper pins,at least two lower pins and a chip. The flexible film is provided with a first surface and a second surface which are opposite to each other, and at least one through hole located in a chip setting area of the first surface. The second surface is provided with a projection area overlapped with the chip setting area. The two conductive members and the insulator are arranged in the through hole, and the two conductive members are separated by the insulator to be electrically separated. The two first upper pins are arranged in the chip setting area and are respectively connected with the two conductive members. The two lower pins extend outwards from the projection area and are electrically connected with the two first upper pins through the two conductive members respectively. The chip is arranged in the chip setting area and comprises at least two first convex blocks; the two first convex blocks are jointed with the two first upper pins.

Description

technical field [0001] The invention relates to a package structure, in particular to a film-on-chip package structure. Background technique [0002] Chip on Film (COF) package structure is a common package type of a driver chip of a liquid crystal display. With the increase in the number of bumps on the chip, the increase in the number of pins and the shrinking of the pitch between the pins, the layout of the bumps and pins is increasingly limited. If the layout of the bumps and pins is improper, bridging is likely to occur during the flip-chip bonding process. [0003] At present, the technology of double-sided circuit film has been proposed, which uses a one-to-one configuration to electrically connect the upper pins on the upper surface of the film and the lower pins on the lower surface of the film through a corresponding number of conductive through holes. Accordingly, the layout flexibility of bumps and pins is improved. The above-mentioned one-to-one configuration...

AI Technical Summary

Problems solved by technology

The above-mentioned one-to-one configuration requires a large number of conductive through-holes, takes up a large area of ​​the film, and still restricts the pin layout to a certain extent, so the number of pins, the number of bumps and the The demand for fine spacing still needs to be further improved to meet the design requirements

Images