Reverse cover screening system

Abstract

The invention provides a reverse cover screening system which can improve the efficiency of automatically screening reverse covers and well avoids product appearance and performance defects. The reverse cover screening system comprises a vibration plate, wherein the vibration plate is provided with a circular orbit, the tail end of the circular orbit is provided with a pickup orbit, the pickup orbit is a section of straight vibration orbit, and an optical recognition system is positioned in front of the pickup orbit and above the circular orbit. The reverse cover screening system provided by the invention is characterized in that the initial position of the circular orbit is provided with a pre-screening area, a first inductor is arranged in the pre-screening area, the first inductor is positioned at the edge of a cover close to the inner side of the circular orbit, the middle section of the circular orbit is provided with a second inductor, the second inductor is positioned at the frontmost edge of the cover along the advancing direction of the orbit, and an optical lens of the optical recognition system faces the frontmost edge of the cover on the circular orbit along the advancing direction of the orbit.

Description

technical field [0001] The present invention relates to the SMD (Surface Mount Device) product packaging process, in particular to a screening system with a series of functions such as classification, identification, and screening of the positive and negative sides of special gold-tin alloy covers, specifically a screening system with reverse covers . Background technique [0002] With the rapid development of communication, electronics and other related industries, the packaging requirements of SMD products are getting higher and higher, and any packaging defects cannot be accepted by customers. SMD products include a cover and a shell. The assembly of the cover and the shell is called packaging. Using gold-tin solder reflow soldering technology, the cover and the ceramic shell are welded and fixed by instantaneous high temperature. However, in the actual production process, often appear on the cover reverse defect. Existing cover reverse screening systems see figure 1 ...

AI Technical Summary

Problems solved by technology

Existing cover reverse screening systems see figure 1 , which adopts the working principle of the optical recognition system. The optical recognition system 7 is set above the vibrating plate, in front of the cover 2 picking up track 8, and its optical lens is directly facing the cover 2 placed on the vibrating plate and on the circular track 1. In the complete area 3, the optical recognition system can use the different reflective features of the front and back sides of the cover to screen out the reverse cover. However, because the differences on the surface of the gold-tin solder cover are not obvious, the solder characteristics on the cover surface have certain fluctuations. Therefore, the existing cover reverse screening system cannot completely pick out the reverse cover, and the defective cover enters the cover picking area, resulting in low screening efficiency and ultimately affecting product quality

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